ABOUT

Engineering the Future of Microelectronics

From precision wafer dicing & grinding to advanced SiC power packaging and final testing, GEEKVALUE delivers robust backend equipment solutions for OSATs and fabs worldwide.

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Sq.m Class 10 Cleanroom
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Equipment Sets Delivered
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Registered Core Patents
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Years R&D Innovation
Semiconductor backend equipment cleanroom assembly

Precision Assembly Under Class 10 Cleanroom

Our facility operates under rigorous Class 10 cleanroom standards. Every backend machine—from Dicing Saws and Wafer Grinders to Die Bonders and Test Handlers—undergoes strict calibration and quality inspection before shipment to ensure micron-level operational precision.

  • Strict ISO 14644-1 Class 10 environmental controls
  • Precision mechanical alignment & calibration testing
  • Rigorous incoming component quality assurance
Global technical support and spare parts logistics for semiconductor equipment

Comprehensive Support & Global Logistics

Beyond delivering machines, we ensure your lines never stop. We maintain a massive on-hand inventory of genuine consumables, and our global engineering team provides 2-hour remote diagnosis and rapid on-site deployment to keep your production running 24/7.

  • Robust spare parts inventory (capillaries, dicing blades, sockets)
  • 2-hour remote troubleshooting and screen-mirroring support
  • On-site field installation & local engineer training

The GeekValue Journey

A legacy of precision engineering and global industrial services.

Founding Team's Entry into Precision Assembly

Engineering Roots in Precision Automation

Since 2009, our core engineering team has accumulated over 15 years of hands-on experience in precision electromechanical systems and industrial machinery. This deep technical mastery in complex automation laid the solid foundation for our current expertise in semiconductor backend equipment.

Strategic Focus on SiC/GaN Backend Processes

Anticipating the EV and power electronics revolution, we initiated R&D to master precision dicing, bonding, and molding processes specifically tailored for hard-brittle third-generation compound semiconductors.

Incorporation of Xinling Industrial

On January 28, 2021, Guangdong Xinling Industrial Co., Ltd. was officially established in Shenzhen, formally launching the GeekValue brand into the semiconductor backend equipment market.

Global Expansion & High-Tech Designation

Rapid growth in international markets (Europe & Americas) was recognized with our 2025 designation as a National High-Tech Enterprise and Sci-Tech SME, validating our R&D strength and global service capabilities.

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WHO WE ARE

Corporate Culture & Values

Rooted in long-termism, we create real value through technology. We believe that a strong corporate culture is not a slogan, but the decisions and actions we take every day.

Co-Creation

Diversity Co-creation

Symbiosis

Pluralistic Symbiosis

Sharing

Multiple Sharing

Development Philosophy

Uniting technology and talent to deliver measurable commercial value for our customers and drive continuous industry progress.

Service Philosophy

Geek spirit + geek technology + geek service, delivering professional experiences that exceed expectations.

Talent Philosophy

Providing a platform for doers and a stage for creators, empowering every individual to shape the final outcome.

Ready to Power Your Next Innovation?

Partner with a foundry that understands precision. Contact our engineering team today.

Contact Our Team