Backend Equipment Expertise at Your Fingertips

A Die Bonder performs precision die attach onto lead frames or substrates using epoxy for conventional packaging. In contrast, our Flip Chip Bonder utilizes advanced thermo-compression bonding (TCB) to achieve direct solder bump interconnections. This enables sub-micron positioning accuracy, making it essential for 2.5D/3D IC and high-density advanced packaging applications.

Our precision dicing saws are equipped with optimized high-speed diamond blades and advanced cooling systems specifically designed for third-generation semiconductors. This dual-blade capability minimizes chipping and micro-cracking while cutting SiC and GaN wafers, ensuring excellent surface integrity and fully supporting 8-inch and 12-inch wafer sizes.

We provide complete testing solutions for both stages. CP (Circuit Probing) testing uses our automatic Probe Stations to identify known-good dies directly on the wafer before dicing. FT (Final Testing) utilizes our Test Handlers and ATE Systems to perform comprehensive electrical verification and automated sorting on packaged ICs, ensuring zero-defect shipments.

During semiconductor packaging, surfaces often have microscopic organic contaminants. Our advanced dry plasma cleaning systems perform molecular-level surface activation before wire bonding and molding. This process removes impurities, significantly enhancing atomic-level adhesion strength and preventing delamination, which directly improves overall packaging reliability.