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Semiconductor Encapsulation Equipment

Semiconductor Molding Machines for IC Packaging

A semiconductor molding machine encapsulates chips, wire bonds and package structures with protective resin. Browse available transfer and compression molding equipment, then compare the package format, resin type, mold configuration, automation level and actual machine condition required for your production line.

Browse Molding Machines → Discuss Your Package
Transfer Molding Compression Molding IC & Power Packages Wafer / Panel Molding
Package First

Start With the Package Format and Resin Flow

The same molding platform is not automatically suitable for every semiconductor package. Leadframe products, substrate-based arrays, power modules, wafers and panels place different demands on mold size, clamp force, resin delivery, release film, handling and post-mold cleaning.

Tell us what is entering the mold and what the finished package should look like. This is usually more useful than starting with machine tonnage alone.

For wire-bonded devices, resin flow must also be reviewed against wire length, loop profile and package density. For wafer- or panel-level molding, uniform resin distribution and warpage control become more important.
Package Route Typical Method What Must Be Confirmed
Leadframe IC Packages

QFN, SOP, DIP, discrete and related molded packages.

Transfer Molding

Leadframe size, cavity layout, pellet delivery, wire-sweep risk, chase and tooling compatibility.

Substrate & MAP Packages

BGA, MAP-QFN, SiP and multi-die package arrays.

Transfer or Compression

Substrate dimensions, mold thickness, resin flow length, exposed features and singulation route.

Wafer & Panel-Level Packaging

FOWLP, FIWLP, EWLP, PLP and advanced package structures.

Compression Molding

Wafer or panel size, dispense pattern, resin form, thickness uniformity, release film and warpage control.

Power, Sensor & Optical Products

Thick devices, heat-spreader exposure, modules, sensors and LED-related products.

Application-Specific

Device height, thermal path, exposed metal, liquid or granular resin, mold pressure and demolding method.

Available Equipment

Browse Semiconductor Molding Machines

Review the current equipment collection and open each model page for available specifications. The final quotation should identify the actual mold press, handling modules, tooling interface, software, accessories and refurbishment scope supplied with the machine.

Need a specific TOWA, ASMPT, Yamaha or another molding platform? Send the complete model name, package type and preferred condition for a focused availability check.
Besi Fico FML Molding System

Besi Fico FML Molding System

Pre-owned Besi Fico FML semiconductor molding system. Ask about machine condition, mold compatibility, included equipmen...

Molding Method

Transfer Molding or Compression Molding?

The difference is mainly how the resin reaches the package. This affects resin movement around the device, mold construction, material use, package size and the type of product the machine is designed to handle.

Resin enters through a gate

Transfer Molding

The mold closes first, then heated resin is transferred through runners and gates into the package cavities before curing.

  • Common for leadframe, substrate and established IC package formats
  • Requires review of runner, gate, cavity and pellet or resin delivery configuration
  • Wire sweep, flash, short fill and resin bleed must be controlled through mold and process conditions
  • Actual package compatibility depends on the installed mold chase, tooling and handling system
Resin is placed in the mold area

Compression Molding

Resin is dispensed or placed into the mold area and compressed around the device, reducing the need for long transfer paths.

  • Often considered for wafer-level, panel-level, thin-package and advanced packaging applications
  • Can reduce resin flow around delicate structures, depending on the mold and process design
  • Requires confirmation of wafer or panel size, resin form, dispense route and release-film handling
  • Thickness uniformity, void control, warpage and demolding remain important selection points
Mold Quality

Select the Machine Around the Defects You Need to Prevent

Output is not determined by press force alone. Resin behavior, mold temperature, vacuum, clamp balance, package layout, wire geometry, release condition and post-mold handling all affect the finished package.

When replacing an existing molding machine, share current defects and package samples. They often reveal more than a general request for a “higher-capacity” system.

RiskWire Sweep

Resin flow can move long or closely spaced bond wires during encapsulation.

Review flow path, wire loop and fill conditions
RiskVoids & Incomplete Fill

Air removal, vacuum, preheat, resin condition and feature geometry influence filling.

Confirm vacuum, dispense and cure route
RiskFlash & Resin Bleed

Mold contact, clamp balance, film, chase condition and process pressure affect overflow.

Inspect mold interface and clamp system
RiskWarpage & Thickness Variation

Large substrates, wafers and panels require controlled pressure and resin distribution.

Match package size, mold flatness and resin pattern
RiskSticking & Demold Damage

Release film, mold surface, cure condition and eject sequence affect package removal.

Verify release-film and demolding configuration
Production Mode

Match Automation to Product Mix and Output

Manual, modular and fully automatic molding systems serve different production environments. The right choice depends on package changeover, loading format, mold exchange, resin handling, traceability and the volume expected from each product family.

Manual or Laboratory System

Useful for process development, package trials, low-volume production and applications where operators load the package, resin and tooling directly.

  • Flexible for experiments and frequent product changes
  • Operator involvement is high
  • Confirm mold size, clamp force and safety configuration

Modular or Semi-Automatic System

Combines controlled molding with selected automation for loading, preheating, resin handling or unloading.

  • Useful for mixed production and staged automation
  • Change kits and mold exchange time become important
  • Can be integrated with separate handling modules

Fully Automatic Molding Line

Designed for repeatable high-volume encapsulation with automated loading, resin management, molding, unloading and production data handling.

  • Best evaluated as a complete line, not only as a press
  • Package logistics and upstream/downstream interfaces matter
  • Software, recipes and factory integration must be confirmed
Used Equipment Check

Verify the Actual Molding System, Not Only the Model Name

A used semiconductor molding machine may have been configured for one package family, resin system or factory layout. Before quotation, the installed press, mold interface, handling units, software, utilities and included accessories should be reviewed as one system.

Ask AboutWhat We Need to Confirm
Machine Identity
Complete model, serial number, production year, manufacturer records and current location.
Molding Method
Transfer or compression platform, press capacity, chamber or module arrangement and supported resin route.
Package Handling
Leadframe, substrate, strip, wafer or panel format; loader, preheater, shuttle, unloader and buffer configuration.
Mold & Tooling Interface
Chase dimensions, mold height, clamp arrangement, release-film system, change kit and included tooling.
Software & Controls
Controller version, recipes, language, licenses, traceability functions and factory communication options.
Condition & Refurbishment
Press alignment, heaters, vacuum, hydraulic or servo system, maintenance history, replaced parts and test scope.
Utilities & Delivery
Power, air, vacuum, exhaust, cooling, machine dimensions, dismantling, export packing and installation plan.
Continue the Packaging Flow

Molding normally follows die attach and wire bonding, then connects to package deflashing, trim and form, marking and final test. Use these links only when the project also includes the adjacent process.

Upstream Interconnect

Wire Bonder

Review fine-wire interconnect equipment before encapsulating wire-bonded packages.

Browse wire bonders → Surface Preparation

Plasma Cleaner

Evaluate surface cleaning and activation when package adhesion or contamination is a concern.

Explore plasma cleaning → Package Finalization

Trim and Form

Continue from molded leadframe packages into deflashing, trimming, forming and singulation.

View trim and form equipment → Identification

Laser Marking Machine

Add device identification, date code, lot code, logo or Data Matrix after molding.

Browse marking systems → Technical Reading

Semiconductor Guides

Continue into packaging process comparisons, equipment selection and used-machine purchasing topics.

Read related guides →
Common Questions

Questions Before Choosing a Molding Machine

Start with the package, resin and production route. A model can then be checked against the actual mold, handling and process configuration required.

What does a semiconductor molding machine do?

It encapsulates semiconductor chips, interconnects and package structures with cured resin to provide mechanical protection, environmental isolation and the final molded package form.

What is the difference between transfer molding and compression molding?

Transfer molding moves heated resin through runners and gates into a closed mold. Compression molding places or dispenses resin in the mold area and compresses it around the device. The suitable method depends on package architecture, resin flow requirements and production format.

Can one molding machine process every IC package?

No. Compatibility depends on mold dimensions, clamp force, resin delivery, chase and tooling, package handling, software and the options installed on the actual machine.

Which molding method is used for wafer-level or panel-level packaging?

Compression molding is widely considered for many wafer- and panel-level applications, but the final choice still depends on wafer or panel size, resin form, dispense method, target thickness, release-film handling and warpage limits.

What causes wire sweep during semiconductor molding?

Wire sweep can result from resin flow acting on bond wires. Wire length, loop geometry, package layout, flow path, viscosity, fill speed, temperature and mold design all influence the risk.

What should be checked when buying a used molding machine?

Confirm the exact model, year, molding method, press and mold interface, handling modules, software, vacuum and heating systems, included tooling, maintenance history, operating condition, utilities and refurbishment scope.

What information is needed for a quotation?

Send the target package, strip or wafer size, molding method if known, resin type, mold dimensions, output requirement, preferred manufacturer or model, required condition, quantity and destination country.

Start With Your Package, Mold or Target Machine

Send the package format, resin, molding method, mold or chase information, output requirement and preferred machine condition. We will review available equipment and the configuration points that need to be confirmed.

Request a Molding Machine Quote View Available Equipment