The DISCO DGP8761 wafer grinder is a fully automatic grinder and polisher designed for advanced semiconductor wafer thinning, backside grinding, and stress relief processing.
Developed by DISCO Corporation, the DGP8761 integrates grinding and polishing processes into a single platform, helping semiconductor manufacturers produce ultra-thin wafers for advanced packaging, stacked die, and next-generation semiconductor applications.
Compared with conventional wafer grinding systems, the DGP8761 focuses not only on thickness reduction but also on improving wafer strength, surface quality, and process stability after thinning.
What is DISCO DGP8761 Wafer Grinder?
The DISCO DGP8761 is a fully automatic wafer grinder/polisher used in semiconductor backend manufacturing.
The equipment combines:
Backside wafer grinding
Fine grinding
Stress relief processing
Dry polishing
Optional CMP processing
The system supports Φ200mm and Φ300mm wafers and is designed for high-precision thin wafer production. :contentReference[oaicite:1]{index=1}
Why Ultra Thin Wafer Processing Matters
Modern semiconductor packaging technologies require thinner and lighter chips.
Wafer thinning enables:
3D IC stacking
HBM memory packaging
Chip stacking
Advanced Fan-Out Packaging
Compact semiconductor packages
However, extremely thin wafers create challenges including:
Mechanical stress
Wafer cracking
Low die strength
Surface damage
Therefore, grinding alone is not enough. Additional polishing and stress relief processes are required.
DISCO DGP8761 Key Technologies
Integrated Grinding and Stress Relief
One of the main advantages of DGP8761 is integrating backside grinding and stress relief processes into one machine.
This reduces wafer handling steps and improves process consistency.
3 Axis Processing System
The DGP8761 uses a 3-axis configuration with 4 chuck tables.
The additional Z3 spindle provides flexible thin wafer processing options including dry polishing, CMP, and super fine grinding. :contentReference[oaicite:2]{index=2}
Ultra Thin Wafer Processing Below 25μm
The system supports stable thin wafer processing below 25μm thickness, making it suitable for advanced semiconductor packaging requirements. :contentReference[oaicite:3]{index=3}
Dry Polishing Technology
DISCO dry polishing technology provides stress relief without using chemical liquids or water.
This helps improve environmental performance while maintaining wafer strength.
DBG and SDBG Capability
The DGP8761 supports advanced processes including DBG (Dicing Before Grinding) and SDBG applications.
These processes help improve thin wafer handling and reduce wafer damage during semiconductor manufacturing. :contentReference[oaicite:4]{index=4}
DISCO DGP8761 Process Flow
Wafer loading
Wafer positioning
Coarse grinding
Fine grinding
Stress relief polishing
Cleaning and drying
Wafer transfer
Process Flow:
Wafer Loading → Rough Grinding → Fine Grinding → Dry Polishing / CMP → Cleaning → Drying → Next Process
DISCO DGP8761 Technical Features
High Throughput Thin Wafer Processing
The optimized handling layout and newly developed spindle design improve processing efficiency compared with previous DGP8760 generation equipment. :contentReference[oaicite:5]{index=5}
8000 Series Compatibility
The DGP8761 maintains compatibility with DISCO 8000 series consumables including grinding wheels and dresser boards, helping manufacturers simplify maintenance and spare parts management. :contentReference[oaicite:6]{index=6}
Advanced Surface Quality Control
The combination of grinding and polishing helps reduce surface damage and improve wafer reliability after thinning.
DISCO DGP8761 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic grinder/polisher |
| Manufacturer | DISCO Corporation |
| Model | DGP8761 |
| Wafer Size | Φ200mm / Φ300mm |
| Chuck Tables | 4 chuck tables |
| Axis Configuration | 3 axes |
| Main Process | Back grinding + stress relief |
| Grinding Wheel | Φ300mm diamond wheel |
| Polishing Pad | Φ450mm dry polishing / CMP option |
| Thin Wafer Capability | Below 25μm processing |
Specifications are based on DISCO published product information. :contentReference[oaicite:7]{index=7}
Applications of DISCO DGP8761
Advanced Packaging
The DGP8761 supports wafer thinning processes required for advanced semiconductor packaging technologies.
HBM and Memory Packaging
Thin wafer processing is essential for stacked memory applications where multiple dies are vertically integrated.
3D IC Manufacturing
Ultra-thin wafer capability enables high-density semiconductor integration.
Power Semiconductor Processing
Controlled backside processing helps improve thermal and electrical performance for power devices.
DISCO DGP8761 vs DFG8560
| Equipment | Main Function |
|---|---|
| DISCO DFG8560 | High precision wafer backside grinding and thinning |
| DISCO DGP8761 | Grinding + polishing + stress relief for ultra-thin wafers |
DFG8560 is mainly used for wafer thickness reduction, while DGP8761 provides a complete thin wafer finishing solution for advanced packaging applications.
Maintenance Considerations
Grinding wheel condition inspection
Polishing pad replacement
Chuck table accuracy calibration
Spindle vibration monitoring
Cooling water inspection
Process thickness verification
For refurbished DGP8761 systems, important evaluation points include spindle condition, grinding accuracy, polishing performance, and process repeatability.
Summary
The DISCO DGP8761 wafer grinder is an advanced semiconductor wafer thinning and polishing system designed for ultra-thin wafer production.
With integrated grinding, stress relief, dry polishing, and advanced thin wafer processing capability, the DGP8761 supports next-generation semiconductor packaging requirements including HBM, 3D IC, and advanced chip stacking applications.
