Used CA2 Process and Configuration Review

ASMPT SIPLACE CA2 Pick and Place Machine

Start with the process you need, then confirm whether the candidate CA2 is built to support it.

SIPLACE CA2 combines feeder-supplied SMD placement with direct wafer-fed die handling. This page keeps the published platform specifications visible while helping you translate a real product requirement into the placement heads, wafer hardware, transport and software that should be checked on a candidate used machine.

View Used CA2 Equipment Start a CA2 Configuration Review

Reference image only. Current availability and the installed configuration of any offered machine must be confirmed separately.

Published Equipment Records

Used SIPLACE CA2 Equipment

Review the CA2 listings currently published on the website, then open the individual record to check the machine-specific information available for that unit.

Ask About CA2 Availability

Published records identify individual equipment listings. Availability, installed options, condition, included accessories and delivery scope must still be confirmed for the specific machine.

The CA2 Process Direction

Two Material Streams Are the Starting Point

CA2 is worth reviewing when the same product needs conventional SMD placement and dies supplied directly from a sawn wafer. That combination is the platform's defining role, but it is only the first part of the buying decision.

A candidate machine still needs the correct placement head, wafer system, substrate transport and software environment. The purpose of this page is to connect the published CA2 capability with the actual machine build you may be offered.

The key question is not whether CA2 is technically impressive, but whether its mixed material flow solves the product and production problem you actually have.

CA2 Process Overview
Material Stream 01

Feeder-Supplied SMDs

Reel-fed and supported feeder-supplied components enter the SMT placement side of the process.

Material Stream 02

Direct Wafer-Fed Dies

Bare dies are picked directly from a sawn wafer for die-attach or flip-chip placement.

One Candidate CA2 Process The platform direction may fit the product, but the installed machine configuration determines how closely it can support the intended production flow.
Published CA2 Specifications

Published SIPLACE CA2 Reference Specifications

These figures remain useful for early screening. They describe the published CA2 platform, while the installed options, condition and usable output of a specific used machine still need to be confirmed.

76,000 cphPublished maximum SMT placement reference
54,000 cphPublished maximum die placement from wafer
51,000 cphPublished maximum flip-chip placement from wafer
10 µm @ 3σHighest published CA2 accuracy class

Component and Die Range

Placement head
CP20 reference
Feeder components
0201 metric to 8.2 mm × 8.2 mm × 4 mm
Wafer dies
Approx. 0.3 mm × 0.3 mm to 8.2 mm × 8.2 mm
Process direction
SMD, die attach, flip chip or mixed placement, depending on configuration

Wafer and Material Handling

Material streams
Feeder-supplied SMDs plus dies directly from sawn wafers
Multi-wafer system
Published capacity for up to 50 wafer types
Traceability
Individual die tracking from wafer position to board position
Published options
Die sensing, crack and edge-damage inspection, dipping control and in-line inspection

Transport and Factory Integration

Single track
Up to 620 mm × 700 mm at published 20/15 µm classes; 300 mm × 300 mm at 10 µm
Dual track
Ranges vary by accuracy class, including up to 375 mm × 260 mm at 20 µm
Communication
IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 and SECS/GEM
Dimensions
Approx. 2.56 m × 2.50 m × 1.85 m

Buying context: Published values help position the platform. A candidate machine still needs the correct head, wafer hardware, transport, software and supporting records for the intended process.

From Product Requirement to Candidate Machine

Match Your Process Requirement to the Candidate CA2

You should not have to decode the entire machine configuration on your own. Start with the product, wafer input, substrate and factory environment; those needs can then be compared with the documented build of the candidate machine and separated into likely fit, configuration gaps and open points.

01

Placement Process, Head and Accuracy

What Your Process Requires

The component and die mix, placement mode, target accuracy, throughput direction and any low-force, no-contact or dipping requirement.

What We Look for on the Candidate

The documented placement-head build, accuracy class, vision options, supported range, process modules and available calibration or acceptance records.

Fit, Gap or Open Point

A missing head, camera or process option may mean additional hardware, tooling or qualification work before the product can be introduced.

02

Wafer Handling and Die Supply

What Your Process Requires

The wafer and frame format, carrier film, die range, mapping method, traceability level and required wafer capacity.

What We Look for on the Candidate

The installed wafer changer, tables or chucks, ejector, buffer, mapping support and documented compatibility with the target wafer format.

Fit, Gap or Open Point

A mismatch can lead to additional wafer hardware, custom tooling, software setup or process development rather than a simple machine installation.

03

Transport and Product Format

What Your Process Requires

The substrate or panel dimensions, lanes, carrier concept, product support, warpage conditions and line-flow arrangement.

What We Look for on the Candidate

The installed single- or dual-track system, usable width, flow direction, support hardware and relevant carrier or inspection options.

Fit, Gap or Open Point

The placement process may fit while the transport does not, creating additional conveyor, carrier, support or line-integration work.

04

Software, Traceability and Integration

What Your Process Requires

The recipe, die-level traceability, production data, MES connection, communication protocol and documentation expected by the factory.

What We Look for on the Candidate

The documented software version, available licenses and backups, WORKS modules, protocols, interfaces and supporting machine records.

Fit, Gap or Open Point

A machine may run independently but still require licensing, data preparation, interface work or additional documentation before line integration.

A Lower-Barrier Equipment Review

Start with the Process Information You Already Have

The first conversation does not need to begin with a complete CA2 configuration sheet. A short description of the product and production flow gives us a practical starting point for reviewing the available candidate information.

  1. 01 You Tell Us

    Describe the Product and Process

    Share the material streams, substrate, target accuracy, output direction, wafer presentation and factory requirements that matter to the project.

    A concise application summary is enough to begin. We can identify which machine details are still needed.

  2. 02 We Review

    Compare the Candidate Build

    We organize the available machine identity, heads, wafer system, transport, software, documentation and condition evidence around your process requirement.

    Confirmed items, likely gaps and undocumented points are separated instead of being hidden inside a generic model quotation.

  3. 03 You Receive

    A Defined Candidate Scope

    The quotation can identify the candidate machine, documented configuration, included tooling and accessories, software or files, and agreed packing and delivery scope.

    Open points, seller-dependent confirmation and possible additional engineering are listed separately.

What You Receive Before Quotation

The review keeps confirmed information, configuration gaps and unresolved items visible before a machine scope is priced.

Candidate Fit SummaryHow closely the documented build follows the project requirement.
Gap and Open-Point ListKnown differences and information that still needs confirmation.
Defined Quotation ScopeWhat the price includes and which items remain separate or optional.

Not sure which CA2 configuration your process needs? Start with the product, wafer input and substrate format. We will organize the machine-level questions from there.

Start a CA2 Configuration Review
Frequently Asked Questions

ASMPT SIPLACE CA2 Questions

Is SIPLACE CA2 an SMT machine or a die-attach machine?

ASMPT describes CA2 as a combination of an SMT placement machine and a die bonder. It can place feeder-supplied SMDs and dies taken directly from sawn wafers in one work step, subject to the installed machine configuration.

Can every used CA2 achieve the published throughput and accuracy?

No. Published values describe the platform and its available accuracy classes. The actual result depends on the installed heads, process mode, component mix, transport, software, maintenance condition and agreed acceptance method.

Do I need a complete machine specification before contacting you?

No. A short explanation of the product, material inputs, substrate, target accuracy and production environment is enough for the first review. The missing machine-level questions can then be organized around that application.

What happens when the candidate CA2 is not an exact fit?

The useful next step is to separate manageable conversion work from fundamental process mismatches. Missing tooling, software or a specific option may be addressable, while a different material flow or transport concept may point to another equipment direction.

Review the Candidate CA2 Before Defining the Equipment Scope

Tell us what the product and process require. We will organize the available candidate information around that requirement and clarify the likely fit, configuration gaps and quotation scope.

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