The SINTAIKE STK-6020 semiconductor wafer mounter is a semi-automatic wafer tape lamination system designed for semiconductor wafer thinning and backend processing applications. Developed by SINTAIKE Semiconductor Equipment, the STK-6020 provides a practical solution for wafer protection tape mounting before back grinding and dicing processes.
SINTAIKE STK-6020 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Semi-automatic wafer tape laminator |
| Manufacturer | SINTAIKE Semiconductor Equipment |
| Main Application | Wafer protection tape mounting before thinning and dicing |
| Applicable Wafer Size | 4 inch / 5 inch / 6 inch / 8 inch |
| Wafer Thickness | Approximately 300-750 μm |
| Compatible Film | Blue tape and UV tape |
| Lamination Method | Anti-static roller lamination |
| Control System | PLC-based control system |
| Operation Mode | Semi-automatic loading and unloading |
| Application Field | Semiconductor, MEMS, LED, power devices |
Actual performance depends on wafer material, tape specification, wafer thickness, and production requirements. :contentReference.
SINTAIKE STK-6020 Wafer Mounting Process Flow
Wafer preparation
Tape loading
Manual wafer positioning
Automatic tape lamination
Film cutting
Wafer transfer to grinding or dicing process
Process Flow:
Wafer Preparation → Tape Mounting → Film Cutting → Inspection → Back Grinding / Dicing
Applications of SINTAIKE STK-6020
Wafer Back Grinding Preparation
The primary application of STK-6020 is applying protective tape before wafer thinning. The tape protects wafer surfaces during mechanical grinding.
Wafer Dicing Preparation
The system can also support wafer fixation before dicing operations, helping maintain wafer stability during cutting.
MEMS Semiconductor Processing
MEMS devices often require careful wafer handling due to their sensitive structures. Stable tape mounting helps reduce process risks.
LED and Power Semiconductor Manufacturing
LED and power semiconductor wafers can benefit from controlled wafer protection before separation and packaging processes.
