BESI Datacon 2200 EVO is a modular automatic die attach platform designed for semiconductor backend packaging processes requiring multi-process flexibility. It supports epoxy, eutectic, and soft solder bonding methods depending on system configuration.
Key applications: RF devices, optoelectronics, power semiconductors, MEMS sensors, and mixed-technology semiconductor packaging.
What is BESI Datacon 2200 EVO?
The Datacon 2200 EVO is a fully automatic die bonding system used in semiconductor packaging to place dies onto substrates or leadframes using different bonding technologies. Unlike single-process high-speed platforms, it is designed for flexible manufacturing environments where multiple package types are produced on the same equipment.
Supported Die Bonding Processes
The system can be configured for different semiconductor packaging requirements:
Epoxy Die Attach: Common in standard IC packaging using adhesive dispensing methods.
Eutectic Bonding: Used in RF and high-frequency devices requiring improved thermal and electrical conductivity.
Soft Solder Bonding: Applied in power semiconductor devices where thermal dissipation and void-free bonding are critical.
Technical Specifications (Typical Configuration)
Performance depends on machine configuration, bonding module selection, and process conditions.
| Parameter | Typical Value |
|---|---|
| Platform Type | Modular automatic die bonder |
| Placement Accuracy | ±10–15 μm @ 3σ (process dependent) |
| Throughput | Depends on bonding process (epoxy / eutectic / solder) |
| Wafer Handling | 8-inch or 12-inch (configuration dependent) |
| Substrate Type | Leadframe, strip, laminated substrates |
| Bonding Methods | Epoxy / Eutectic / Soft Solder (module dependent) |
Applications in Semiconductor Packaging
The Datacon 2200 EVO is utilized in multi-process semiconductor packaging environments requiring flexible die attach capability.
Optoelectronics & Sensors
Image sensors
MEMS devices
Optical communication components
Power Semiconductor Devices
Power MOSFETs
IGBT-related discrete devices
Thermally critical power components
RF & Communication Devices
RF amplifiers
High-frequency ICs
Mixed-signal semiconductor devices
Semiconductor Backend Process Integration
The die attach process using Datacon 2200 EVO is typically performed after wafer dicing. Devices are then transferred to wire bonding or flip chip assembly depending on packaging requirements.
Its modular substrate handling system supports integration with leadframe and strip-based production lines, making it suitable for existing semiconductor backend manufacturing environments.
Frequently Asked Questions (FAQ)
What is the Datacon 2200 EVO used for?
It is used for semiconductor die attach processes supporting epoxy, eutectic, and soft solder bonding methods.
What makes it different from high-speed die bonders?
Unlike high-speed single-process machines, the 2200 EVO focuses on process flexibility and supports multiple bonding technologies in one platform.
Can it handle advanced packaging applications?
It supports selected advanced packaging processes such as eutectic bonding for RF and sensor devices, but sub-micron interconnect applications typically require dedicated flip chip equipment.
Request Technical Specification or Quotation
If you are evaluating flexible die attach equipment for semiconductor packaging, our engineering team can provide configuration guidance, process compatibility analysis, and machine specifications.
👉 Contact us for:
Equipment specification sheet
Configuration options based on your process
Refurbished equipment availability
Integration support for production lines
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