The Besi Fico AMS-i is a fully automatic molding system used for semiconductor package encapsulation. It handles compatible leadframes with pelletized molding compound and can be configured with multiple press stations for automated production.
The actual molds, presses, loading system, inspection functions and software condition depend on the specific pre-owned machine available. For an initial inquiry, send your current molding-machine model, clear photos of the leadframe or molded package and a short description of the required process.
Besi Fico AMS-i Machine Information
| Manufacturer | Besi Fico |
|---|---|
| Model | Fico AMS-i |
| Equipment Type | Fully automatic semiconductor molding system |
| Primary Application | Encapsulation of compatible leadframe-based semiconductor packages |
| Molding Compound | Pelletized molding compound |
| Leadframe Size | Up to 75 mm wide and 280 mm long according to the manufacturer’s model specification |
| Press Configuration | Two- or three-press system according to the model configuration |
| Press Clamp Force | 90 tons according to the manufacturer’s model specification |
| Cavity Temperature Difference | ±2°C according to the manufacturer’s model specification |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
Package and Mold Compatibility
The Fico AMS-i was designed for automated molding of compatible semiconductor package types, but the model name and maximum leadframe dimensions do not by themselves confirm that an available machine can run a particular product. Compatibility also depends on the leadframe layout, package design, mold, pellet size, cavity arrangement and required molded result.
Only basic information is needed for the first discussion:
- Your current molding-machine model if the AMS-i will replace existing equipment
- Clear photos of the leadframe, molded package or current production sample
- A photo of the existing mold or related tooling where available
- A short description of the required molding process or current production problem
Detailed drawings, mold dimensions, cavity data, pellet specifications and process parameters can be reviewed later when the available machine appears relevant to the application.
Automated Molding and Product Changeover
The AMS-i combines leadframe loading, orientation checking, pellet feeding, molding and product unloading in an automated production system. The platform also uses mold identification to support loading of the corresponding process parameters during product changeover.
The usefulness of these functions on a pre-owned machine depends on the installed molds, tooling, sensors, controller, software and handling components. Any existing mold or production setup may have been prepared for a specific leadframe and package and should not be assumed to fit a different product.
Available AMS-i Configuration and Delivery Scope
Individual Fico AMS-i machines may differ in the number of installed presses, molds, cassette handling, pellet-feeding equipment, leadframe inspection, vacuum functions and product-quality inspection options. Before purchase, the available unit should be reviewed to confirm how it is equipped and whether its actual mold, material-handling and process configuration is suitable for the intended package. The final delivery scope is based only on the quotation and confirmed equipment list; production molds, cassettes, product-specific tooling, pellet-feeding equipment, inspection options, computers and external utility systems are included only when specifically stated.
Receiving, Startup and Initial Molding Trial
The machine should be inspected and tested in stages before valuable leadframes or molding compound are introduced.
- Inspect the packing, machine cabinets, press stations, control panel, safety guards and visible handling mechanisms.
- Photograph any impact marks, loose components, damaged cables or displaced assemblies before moving the equipment.
- Compare the received machine, molds, cassettes, tooling and accessories with the confirmed delivery list.
- Check that the presses, molds, pellet-feeding components and leadframe-handling mechanisms remain secured after transportation.
- Confirm the electrical supply, grounding, compressed air, factory exhaust and other facility requirements of the actual machine.
- Start the controller and record all alarm messages before resetting the system or changing process parameters.
- Run a dry cycle and observe cassette handling, leadframe transfer, press movement, sensors and product unloading.
- After the dry cycle is stable, use a suitable mold and non-production leadframes for an initial molding trial.
Repeat several cycles before evaluating production readiness. Stop testing if the press moves abnormally, leadframes are transferred incorrectly, mechanical interference occurs or the same alarm repeatedly returns.
Molding Results, Alarms and Parts Support
Incomplete fill, excessive flash, voids, package cracks, leadframe damage or remaining cull may involve the mold, pellet condition, leadframe position, clamping, vacuum, transfer pressure, temperature or process settings.
Do not continue production if the mold does not open or close correctly, leadframes cannot be loaded safely, molded products cannot be unloaded normally or repeated alarms remain unresolved.
Record the alarm message, affected press station and process stage before resetting the machine. Photos of the leadframe, molded package, mold surface and machine screen, together with a short operating video where available, can provide a practical starting point for review.
Our team can assist with initial fault analysis, component identification, replacement-part matching and repair discussion. Related heaters, sensors, valves, motors, drivers, boards, cables, pneumatic parts and material-handling assemblies can also be checked where available.
Frequently Asked Questions
Can the Besi Fico AMS-i mold our semiconductor package?
This depends on the leadframe, package layout, molding compound, required result and mold installed on the available machine. Send product and leadframe photos for an initial review.
Does the AMS-i have two or three press stations?
The model was available in two- and three-press configurations. The exact number and condition of the presses on the available machine must be confirmed from the specific unit.
Can the machine use our existing Fico mold?
Compatibility must be checked using the mold type, dimensions, leadframe format, press configuration and related tooling. An existing mold should not be considered compatible from the brand name alone.
Are inspection and vacuum functions included?
Some inspection, vacuum and process-monitoring functions were offered as configuration options. Only functions confirmed on the available machine and listed in the quotation are included.
Can you assist with molding defects or machine alarms?
Yes. Send the machine model, alarm information, leadframe and mold photos, molded-product photos and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the Besi Fico AMS-i
Send your current machine model, leadframe or molded-product photos and a short description of the molding requirement or equipment problem. We will review the basic application first and continue with the necessary press configuration, mold, replacement-parts or repair details afterward.
