The Besi AMS-X is an automatic leadframe molding system developed for high-density and power semiconductor packages. It combines leadframe loading, orientation control, molding, degating and output handling within a configurable production line.
The available machine should be evaluated according to its installed mold, leadframe handling modules and current condition. For an initial inquiry, send your existing machine model, a clear product or leadframe photo and a short description of the molding requirement.
Besi AMS-X Leadframe Molding System Specifications
| Manufacturer | Besi |
|---|---|
| Model | AMS-X |
| Equipment Type | Automatic leadframe molding system |
| Primary Application | Molding of high-density and power semiconductor packages |
| Maximum Leadframe Size | 125 × 300 mm |
| Maximum Leadframe Thickness | 10 mm |
| Maximum Clamp Force | 1,800 kN |
| Maximum Mold Opening | 150 mm |
| Maximum Transfer Pressure | 15 MPa |
| Pellet Diameters | 14, 14.3, 16 or 18 mm |
| Machine Dimensions | Approximately 5,160 × 1,500 × 1,800 mm |
| Machine Weight | Approximately 9,500 kg |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine offered |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
Leadframe and Mold Compatibility
The official AMS-X processing range does not by itself confirm compatibility with a particular semiconductor product. The installed mold, cavity layout, leadframe design, package height, pellet specification and required molded result must also correspond to the intended process.
Only basic information is needed for the first discussion:
- Your current molding-machine model, if the AMS-X will replace existing equipment
- A clear photo of the product, strip or leadframe
- A photo of the current mold or molded package where available
- A short explanation of the process requirement or current production problem
Detailed drawings, mold data, compound information and process settings can be discussed later when the available AMS-X appears relevant to the project.
AMS-X Molding and Handling Functions
The AMS-X uses a rigid plate-press structure with four individually controlled clamp sections. This arrangement is intended to distribute clamping force evenly around the product while the molding process is controlled through the machine recipe.
Model-level functions include:
- Slotted-magazine leadframe loading
- Leadframe orientation checking and automatic correction
- Leadframe preheating
- Recipe-controlled deep vacuum
- Individually controlled four-section clamping
- Remote pellet feeding, length checking and pellet cooling
- Integrated degating in the output section
- Optional infeed and outfeed vision inspection
The exact loader, vision units, pellet system, press arrangement and output modules installed on the available used machine must still be confirmed.
Available Configuration and Delivery Scope
A pre-owned AMS-X may have been configured for one leadframe family or production line. Its mold, magazine setup, pellet-feed equipment, inspection units and output modules may therefore differ from another AMS-X.
Only the machine, molds, magazines, tools, cables and accessories listed in the quotation or confirmed delivery list are included. A production mold, external pellet system, vision equipment, exhaust equipment or other line components should not be assumed to be included unless specifically stated.
The available machine configuration, visible condition and included items will be checked according to the actual unit before the order is confirmed.
Installation Requirements
The AMS-X is a large molding system, so factory space, floor loading and utility connections should be planned before delivery. Official model requirements include three-phase electrical power, compressed air and factory exhaust, but the exact voltage and site connection should be confirmed from the available machine nameplate.
| Electrical Supply | Three-phase supply; supported voltage depends on machine configuration |
|---|---|
| Rated Power Consumption | 14 kVA |
| Compressed Air | 4.5–9 bar |
| Average Air Consumption | Approximately 5 m³/h at 6 bar |
| Factory Exhaust | Approximately 2,000 m³/h |
Receiving, Startup and Trial Molding
The machine should be inspected and tested in stages before production leadframes and molding compound are introduced.
- Inspect the packing, machine frames, control panels, press sections, guards and visible transport mechanisms.
- Photograph any impact marks, loose components, damaged cables or shifted assemblies before moving the machine.
- Compare the delivered machine, molds, magazines and accessories with the confirmed delivery list.
- Check that the mold, clamp sections and internal transport components remain secured after shipment.
- Confirm the power, grounding, compressed-air and exhaust connections before startup.
- Start the controller and record any alarm messages before resetting the machine or changing parameters.
- Confirm that the installed modules initialize and return to their correct starting positions.
- Run a dry cycle without production leadframes or molding compound.
- Observe magazine loading, strip transfer, press movement, sensors, degating and output handling.
- After the dry cycle is stable, use a suitable mold and non-production leadframes for an initial molding test.
Several molding cycles should be completed before production readiness is evaluated. Stop the test if mechanical interference, abnormal press movement, unstable vacuum, air leakage or repeated alarms are observed.
Molding Quality, Alarms and Parts Support
Incomplete fill, flash, voids, leadframe damage, package cracks or inconsistent molding may involve the compound, pellet feed, mold condition, clamping, vacuum, temperature, transfer pressure or leadframe position.
Do not continue production if the mold does not close correctly, the leadframe cannot be transferred safely, products cannot be unloaded or the same alarm repeatedly returns.
Record the alarm message, affected station and process stage before resetting the machine. Photos of the leadframe, molded package, mold surface and machine screen, together with an operating video where available, can support an initial fault review.
Our team can assist with initial fault analysis, mold and component identification, replacement-part matching and repair discussion. Related sensors, heaters, valves, motors, drivers, boards, cables, pneumatic parts and transport assemblies can also be checked where available.
Frequently Asked Questions
Can the Besi AMS-X mold our semiconductor package?
This depends on the leadframe dimensions, package design, molding compound, required result and mold installed on the available machine. Send a product or leadframe photo for an initial review.
Is the AMS-X a compression molding machine?
Besi identifies the AMS-X as a leadframe molding system using pellet feeding and transfer-pressure control. It should not be described as a general compression molding machine without confirming the exact process.
Is a production mold included with the machine?
Only molds specifically listed in the quotation or confirmed delivery scope are included. Any supplied mold may have been designed for a particular leadframe and package.
Are vision inspection and pellet-feed equipment included?
These functions depend on the actual machine configuration. They are included only when installed on the available unit and listed in the confirmed delivery scope.
Can you assist if the AMS-X has an alarm or molding defect?
Yes. Send the machine model, alarm information, leadframe and mold photos, molded-product photos and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the Besi AMS-X
Send your current machine model, a product or leadframe photo and a short description of the molding requirement or equipment problem. We will review the basic information first and continue with the necessary AMS-X configuration, mold, replacement-parts or repair details afterward.
