The TOWA CPM1080 is a compression molding system developed for wafer-level and panel-level semiconductor packaging. The platform supports compatible wafers and panels using granular or liquid molding resin, while the actual automation level, press modules, mold and material-handling configuration depend on the specific machine available.
For an initial inquiry, send your current molding-machine model, clear photos of the wafer, panel or molded product, and a short description of the required process. We can review the basic requirement first and continue with detailed mold and configuration checks only when necessary.
TOWA CPM1080 Machine Information
| Manufacturer | TOWA |
|---|---|
| Model | CPM1080 |
| Equipment Type | WLP and PLP compression molding system |
| Workpiece Type | Semiconductor wafer or panel |
| Panel Size Range | 150–320 mm according to the manufacturer’s model specification |
| Maximum Wafer Size | Up to Ø320 mm according to the manufacturer’s model specification |
| Molding Compound | Granular or liquid resin, depending on the installed configuration |
| Standard Machine Time | Approximately 88 seconds; actual cycle time depends on the product, mold and process |
| Press Modules | One or two modules according to the model configuration |
| Clamp Capacity | 98–784 kN according to the manufacturer’s model specification |
| Automation Level | Full-auto, semi-auto or manual version confirmed from the actual machine |
| Condition | Pre-owned semiconductor packaging equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
WLP and PLP Process Compatibility
The CPM1080 model range is designed for wafer-level and panel-level molding, but the stated workpiece range does not by itself confirm compatibility with a specific product. The available machine must also match the wafer or panel thickness, package layout, mold, resin type, release-film arrangement and required molded result.
Only basic information is needed for the first discussion:
- Your current molding-machine model if the CPM1080 will replace existing equipment
- Clear photos of the wafer, panel, substrate or molded product
- A photo of the current mold or loading fixture where available
- A short description of the required molding result or current production problem
Detailed drawings, dimensions, warpage information, resin data and mold specifications can be discussed later when the available machine appears relevant to the project.
Available CPM1080 Configuration and Delivery Scope
The TOWA CPM1080 was available in automatic, semi-automatic and manual configurations, and individual pre-owned machines may differ in press modules, molds, resin-supply systems, release-film components and wafer or panel handling arrangements. Before purchase, the available unit should be reviewed to confirm how it is equipped and whether its actual configuration is suitable for the intended molding process. The final delivery scope is based only on the quotation and confirmed equipment list; production molds, panel carriers, resin equipment, release-film components, computers and external utility systems are included only when specifically stated.
Receiving, Startup and Initial Molding Trial
The machine should be inspected and tested in stages before valuable wafers, panels or molding resin are introduced.
- Inspect the packing, machine frames, press sections, control panels, safety guards and visible handling mechanisms.
- Photograph any impact marks, loose components, damaged cables or displaced assemblies before moving the equipment.
- Compare the received machine, molds, fixtures and accessories with the confirmed delivery list.
- Check that the mold, press modules, resin-related components and material-handling mechanisms remain secured after transport.
- Confirm the electrical supply, grounding, compressed air, exhaust and other facility requirements of the actual machine.
- Start the controller and record all alarm messages before resetting the system or changing process parameters.
- Confirm that the installed modules initialize and return to their correct starting positions.
- Run a dry cycle without production workpieces or molding resin.
- Observe loading, transfer, press movement, sensors, release-film handling and output operation.
- After the dry cycle is stable, use a suitable mold and non-production wafer or panel for an initial molding trial.
Several repeated cycles should be completed before production readiness is evaluated. Stop testing if workpiece transfer is unstable, the press moves abnormally, mechanical interference occurs or repeated alarms remain unresolved.
Molding Results, Alarms and Parts Support
Incomplete fill, flash, voids, cracks, panel warpage or inconsistent molding thickness may involve the workpiece condition, mold, resin distribution, release film, vacuum, clamping or process settings.
Do not continue production if the wafer or panel cannot be loaded safely, the mold does not open or close correctly, resin is distributed unevenly or the same alarm repeatedly returns.
Record the alarm message, affected module and process stage before resetting the machine. Photos of the wafer or panel, molded surface, mold, resin distribution and machine screen, together with an operating video where available, can support an initial review.
Our team can assist with preliminary fault analysis, mold and component identification, replacement-part matching and repair discussion. Related sensors, heaters, valves, motors, drivers, boards, cables, pneumatic parts and material-handling assemblies can also be checked where available.
Frequently Asked Questions
Can the TOWA CPM1080 mold our wafer or panel?
This depends on the workpiece dimensions, thickness, warpage, package layout, resin, required molded result and mold installed on the available machine. Send product photos and basic process information for an initial review.
Does the CPM1080 support both granular and liquid resin?
The CPM1080 model range supports granular and liquid resin configurations. The resin equipment installed on the available used machine must still be confirmed.
Is the available machine full-auto, semi-auto or manual?
The CPM1080 platform was offered in all three versions. The exact automation level of the available machine will be confirmed according to the specific unit.
Is a production mold included with the machine?
Only molds and product-specific tooling listed in the quotation or confirmed delivery scope are included.
Can you assist with molding defects or machine alarms?
Yes. Send the machine model, alarm information, wafer or panel photos, mold photos and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the TOWA CPM1080
Send your current machine model, wafer or panel photos and a short description of the molding requirement or equipment problem. We will review the basic information first and continue with the necessary machine configuration, mold, replacement-parts or repair details afterward.
