The TOWA CPM1180 is a large-panel compression molding system developed for panel-level packaging and compatible wafer molding applications. The platform uses granular molding compound and was available in manual, semi-automatic and fully automatic configurations.
The actual automation level, press modules, mold, resin-dispensing system and panel-handling arrangement depend on the specific pre-owned machine available. For an initial inquiry, send your current molding-machine model, panel or product photos and a brief description of the required molding process.
TOWA CPM1180 Machine Information
| Manufacturer | TOWA |
|---|---|
| Model | CPM1180 |
| Equipment Type | Large-panel compression molding system |
| Primary Application | Panel-level packaging and compatible wafer molding |
| Workpiece Type | Panel or wafer, depending on the machine configuration |
| Maximum Panel Size | Up to 660 × 620 mm for the applicable full-automatic model configuration |
| Maximum Wafer Size | Up to 450 mm for the applicable manual model configuration |
| Molding Compound | Granular resin |
| Standard Machine Time | Approximately 75 seconds for the applicable full-automatic model configuration |
| Clamp Capacity | 49–1,764 kN according to the manufacturer’s model specification |
| Maximum Clamp Speed | 70 mm/sec according to the manufacturer’s model specification |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
Large-Panel PLP Molding Capability
The CPM1180 was developed for large-size panel-level molding. Its molding platform combines a cavity-down mold structure with granular-resin dispensing for compatible large-panel packaging processes.
The system may be configured with different numbers of press modules to suit different production arrangements. Actual output and process results still depend on the installed mold, panel format, resin, molding recipe and press configuration.
Because the CPM1180 was available in manual, semi-automatic and fully automatic versions, the model name alone does not identify the complete setup of a used machine. The available unit must be reviewed according to its actual automation level and installed equipment.
Panel, Product and Mold Compatibility
The maximum model-level panel size does not automatically confirm that the available CPM1180 can mold a particular product. Compatibility also depends on panel thickness, package layout, warpage, mold cavity design, resin distribution and the required molded thickness.
Only basic information is needed for the first discussion:
- Your current molding-machine model if the CPM1180 will replace existing equipment
- A clear photo of the panel, wafer, substrate or molded product
- A photo of the current mold or loading fixture where available
- A short description of the required molding result or current production problem
Detailed drawings, panel dimensions, warpage information, mold data and resin specifications can be discussed later when the available machine appears relevant to the project.
Available CPM1180 Configuration and Delivery Scope
The TOWA CPM1180 was available in manual, semi-automatic and fully automatic configurations, and individual pre-owned machines may differ in press modules, molds, granular-resin dispensing equipment, release-film components and panel or wafer handling arrangements. Before purchase, the available unit should be reviewed to confirm how it is equipped and whether its actual loading, molding and output configuration is suitable for the intended process. The final delivery scope is based only on the quotation and confirmed equipment list; production molds, conversion tools, panel carriers, wafer-handling parts, resin equipment, release-film components, computers and external utility systems are included only when specifically stated.
Receiving, Startup and Initial Molding Trial
The CPM1180 should be inspected and tested in stages before valuable panels, wafers or molding compound are introduced.
- Inspect the packing, machine frames, press modules, control panels, safety guards and visible handling mechanisms.
- Photograph any impact marks, loose components, damaged cables or displaced assemblies before moving the equipment.
- Compare the delivered machine, molds, conversion tools and accessories with the confirmed delivery list.
- Check that the mold, press sections, resin equipment and panel-handling components remain secured after transportation.
- Confirm the electrical supply, grounding, compressed air, exhaust and other facility requirements of the actual machine.
- Start the controller and record all alarm messages before resetting the system or changing process parameters.
- Confirm that the installed press and handling modules initialize and return to their correct starting positions.
- Run a dry cycle without production panels, wafers or molding compound.
- Observe loading, transfer, press movement, resin-related mechanisms and output handling throughout the cycle.
- After the dry cycle is stable, use a suitable mold and non-production workpiece for an initial molding trial.
Several repeated cycles should be completed before production readiness is evaluated. Stop testing if panel transfer is unstable, the press moves abnormally, mechanical interference occurs or repeated alarms remain unresolved.
Molding Results, Alarms and Parts Support
Incomplete fill, uneven resin distribution, voids, flash, panel warpage, cracks or inconsistent molded thickness may involve the workpiece condition, mold flatness, resin distribution, release film, vacuum, clamping or process settings.
Do not continue production if the panel or wafer cannot be loaded safely, the mold does not open or close correctly, the resin is distributed unevenly or the same alarm repeatedly returns.
Record the alarm message, affected module and process stage before resetting the machine. Photos of the workpiece, molded surface, mold, resin distribution and machine screen, together with an operating video where available, can provide a practical starting point for review.
Our team can assist with initial fault analysis, mold and component identification, replacement-part matching and repair discussion. Related sensors, heaters, valves, motors, drivers, boards, cables, pneumatic parts and material-handling assemblies can also be checked where available.
Frequently Asked Questions
Can the TOWA CPM1180 mold our large panel?
This depends on the panel dimensions, thickness, warpage, package layout, resin, required molded result and mold installed on the available machine. Send panel photos and basic process information for an initial review.
Does every CPM1180 support 660 × 620 mm panels?
No. This maximum applies to the relevant full-automatic model configuration. The actual panel capacity of the available machine must be confirmed from its version, mold and handling arrangement.
Is the available CPM1180 manual, semi-automatic or fully automatic?
The CPM1180 platform was available in all three configurations. The automation level and installed handling equipment of the specific machine should be confirmed before purchase.
Is a production mold included with the machine?
Only molds and product-specific conversion tools listed in the quotation or confirmed delivery scope are included.
Can you assist with molding defects or machine alarms?
Yes. Send the machine model, alarm information, panel or wafer photos, mold photos, molded-result photos and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the TOWA CPM1180
Send your current machine model, panel, wafer or molded-product photos and a short description of the molding requirement or equipment problem. We will review the basic information first and continue with the necessary machine configuration, mold, replacement-parts or repair details afterward.
