The KAIJO FB900 wire bonder is a fully automatic gold wire bonding machine developed for LED packaging and related semiconductor assembly applications. Manufactured by KAIJO Corporation, the FB900 is designed to provide stable bonding performance, efficient production, and reliable operation in continuous manufacturing environments.
The machine is commonly used to create fine-wire electrical connections between LED chips or semiconductor dies and package electrodes. Its automatic bonding process helps reduce manual handling, improve production consistency, and support repeatable bonding quality across high-volume packaging lines.
What Is the KAIJO FB900 Wire Bonder?
The KAIJO FB900 is an automatic wire bonding system used in LED backend packaging and selected microelectronic assembly processes. It connects the bonding pads of a die to the corresponding package leads or electrodes using fine gold wire.
During operation, the machine controls bonding force, ultrasonic energy, temperature, positioning, and wire-loop movement to form a stable electrical connection. Automatic alignment and programmed bonding sequences help improve consistency between individual packages.
The FB900 is particularly suitable for production environments that require efficient gold wire bonding, repeatable process control, and stable operation over extended manufacturing cycles.
Key Features of the KAIJO FB900 Wire Bonding Machine
Fully Automatic Wire Bonding Operation
The KAIJO FB900 automates the main wire bonding sequence, including product positioning, bonding-point alignment, wire placement, loop formation, and bond completion. This reduces dependence on manual operation and supports more consistent production output.
Designed for LED Packaging Production
The machine is designed for LED packaging applications that require stable fine-wire interconnection between the LED die and package electrodes. It can be configured according to the package structure, bonding layout, tooling, and production process.
Automatic Vision Alignment
The vision system identifies product features and bonding positions before the bonding cycle. Accurate alignment helps compensate for normal product-position variation and improves bonding-point consistency.
Controlled Wire-Loop Formation
Programmable motion control allows the machine to form wire loops according to the package layout and required loop profile. Proper loop control is important for preventing wire contact, excessive loop height, and unstable package performance.
Stable Continuous Production
The mechanical platform and motion-control system are designed to support repeatable bonding during continuous operation. Actual performance depends on machine condition, tooling, product design, wire specification, and process settings.
Adjustable Bonding Parameters
Bonding force, ultrasonic energy, bonding time, temperature, loop shape, and positioning parameters can be adjusted to match different products and production requirements.
KAIJO FB900 Technical Information
| Parameter | Description |
|---|---|
| Model | KAIJO FB900 |
| Equipment Type | Fully automatic wire bonding machine |
| Manufacturer | KAIJO Corporation |
| Main Application | LED packaging and related microelectronic assembly |
| Bonding Method | Thermosonic wire bonding |
| Typical Wire Material | Gold wire, subject to process configuration |
| Operation Mode | Automatic production operation |
| Alignment | Automatic vision-based product and bonding-point alignment |
| Process Control | Programmable bonding force, ultrasonic energy, bonding time, temperature, and loop profile |
| Product Compatibility | Depends on package dimensions, lead-frame design, bonding layout, tooling, and machine configuration |
Exact specifications may vary according to the machine version, installed options, software configuration, tooling, and previous production setup. The equipment nameplate, configuration list, and current machine condition should be checked before purchase.