The ACCRETECH AP3000 is a high-performance wafer prober developed for electrical testing of semiconductor devices on wafers up to 300 mm. It provides automated wafer loading, alignment, positioning and probe-card contact as part of a complete wafer test setup.
The prober must work together with a compatible tester, test head, probe card, manipulator and chuck configuration. For an initial inquiry, send your current prober or tester model, a wafer or device photo and a short description of the required test process or equipment problem.
ACCRETECH AP3000 Machine Information
| Manufacturer | ACCRETECH / Tokyo Seimitsu |
|---|---|
| Model | AP3000 |
| Equipment Type | High-performance automatic wafer prober |
| Maximum Wafer Size | Up to 300 mm according to the manufacturer’s model information |
| Typical Device Applications | Memory, MPU/SoC, logic and power devices |
| Primary Functions | Wafer handling, alignment, positioning and probe-card contact for electrical testing |
| Condition | Pre-owned semiconductor test equipment |
| Test Configuration | Determined by the tester, test head, probe card, chuck and installed interfaces |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
Wafer and Test Application Compatibility
The AP3000 model name and 300 mm wafer capacity do not by themselves confirm that an available machine can run a particular wafer test. Compatibility also depends on the tester, test-head interface, probe card, wafer layout, device type, chuck temperature range and required contact conditions.
Only basic information is needed for the first discussion:
- Your current wafer prober or tester model if the AP3000 will replace existing equipment
- A clear photo of the wafer, device or current test setup
- The test-head or probe-card model where this information is readily available
- A short description of the required test process or current equipment problem
Detailed wafer maps, interface drawings, probe-card dimensions, temperature requirements and communication settings can be reviewed later when the available machine appears relevant to the project.
Tester, Test Head and Probe Card Integration
The AP3000 positions the wafer and brings each device into contact with a compatible probe card, while electrical measurements are performed by the connected tester. A complete test cell therefore depends on correct mechanical, electrical and software integration between the prober, manipulator, test head, probe card and tester.
An existing probe card or test head should not be assumed to fit the available machine based only on the equipment brand. The mounting arrangement, interface components, card dimensions, contact method and software communication must be checked before installation.
Available AP3000 Configuration and Delivery Scope
Individual ACCRETECH AP3000 wafer probers may differ in loader configuration, test-head interface, manipulator, chuck temperature capability, probe-card setup, wafer ID reader, cassette ID reader, cleaning functions, network connection and factory-automation options. Before purchase, the available machine should be reviewed to confirm whether its actual test and handling configuration is suitable for the intended wafer and tester. The final delivery scope is based only on the quotation and confirmed equipment list; testers, test heads, manipulators, probe cards, chillers, cassettes, computers, interface components and external utility equipment are included only when specifically stated.
Receiving, Startup and Initial Wafer Test
The AP3000 should be inspected and tested in stages before valuable production wafers are introduced.
- Inspect the packing, machine cabinet, loader, stage, chuck, control panel and visible handling mechanisms.
- Photograph any impact marks, loose components, damaged cables or displaced assemblies before moving the equipment.
- Compare the received machine, loader parts, manipulator, interface components and accessories with the confirmed delivery list.
- Check that the chuck, wafer stage, alignment system and handling mechanisms remain secured after transportation.
- Confirm the electrical supply, grounding, compressed air, vacuum, cooling and other facility requirements of the actual machine.
- Start the controller and record all alarm messages before resetting the machine or changing its settings.
- Run the loader, alignment and stage mechanisms without a production wafer and observe their movement.
- After basic operation is stable, use a suitable non-production wafer for loading, alignment, stepping and unloading checks.
The probe card, test head and tester should then be connected and verified separately before electrical test results are evaluated. Stop testing if wafer handling is unstable, stage movement is abnormal, mechanical interference occurs or the same alarm repeatedly returns.
Contact Results, Alarms and Parts Support
Unstable test results may involve the probe card, contact position, wafer alignment, chuck condition, stage accuracy, test-head connection, temperature control or tester communication. Wafer-loading faults, alignment errors, map-data problems and inconsistent probe marks should be investigated before production continues.
Record the alarm message and the stage of the test cycle in which the problem occurs before resetting the machine. Photos of the wafer, probe card, chuck, test-head connection and alarm screen, together with a short operating video where available, can provide a practical starting point for review.
Our team can assist with initial fault analysis, component identification, replacement-part matching and repair discussion. Related sensors, motors, drivers, boards, cables, pneumatic components, vacuum parts, loader assemblies, stage components and chuck-related parts can also be checked where available.
Frequently Asked Questions
Can the ACCRETECH AP3000 test our 300 mm wafers?
This depends on the wafer, device layout, tester, test head, probe card, chuck configuration and required test conditions. Send basic wafer and test-setup information for an initial review.
Is the tester or test head included with the AP3000?
Only testers, test heads, manipulators and interface components specifically listed in the quotation or confirmed delivery scope are included.
Can we use our existing probe card?
Compatibility must be checked using the probe-card type, dimensions, mounting arrangement, test-head interface and required contact setup.
Does the available AP3000 support hot or low-temperature testing?
Ambient, hot-temperature, low-temperature and low-noise chuck arrangements were available for the model platform. The chuck and temperature-control equipment installed on the available machine must be confirmed.
Can you assist with loading, alignment or contact problems?
Yes. Send the machine model, alarm information, wafer and probe-card photos and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the ACCRETECH AP3000
Send your current wafer prober or tester model, wafer or device photos and a short description of the test requirement or equipment problem. We will review the basic application first and continue with the necessary test-head interface, probe-card, machine configuration, replacement-parts or repair details afterward.
