The Applied Materials P5000, also known as the Precision 5000 platform, is a single-wafer, multi-chamber semiconductor processing system. This listed configuration is identified as a PECVD tool for silicon oxide and silicon nitride deposition on 150 mm and 200 mm wafers.
The modular platform can support several separate process chambers around a central wafer-handling system. Because P5000 systems were supplied with different chamber types and process kits, the installed PECVD configuration must be confirmed for the individual used machine.
Applied Materials P5000 PECVD Main Specifications
| Manufacturer | Applied Materials |
|---|---|
| Platform | Precision 5000 |
| Model | P5000 PECVD |
| Equipment Type | Single-Wafer Multi-Chamber PECVD System |
| Listed Wafer Sizes | 150 mm and 200 mm wafers |
| Published Platform Capacity | Up to four separate process chambers, depending on configuration |
| Listed Film Materials | SiO2 and SiN |
| Additional Published PECVD Material | Amorphous silicon on appropriately configured systems |
| Published Operating Temperature | Approximately 200–400°C for a representative PECVD configuration; chamber-specific range must be confirmed |
| Wafer Processing | Single-wafer sequential processing |
| Source Listing Status | Listed for sale; current quantity and configuration should be reconfirmed |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, chamber configuration and inspection confirmation |
Key Equipment Features
Single-wafer multi-chamber platform architecture
Listed support for 150 mm and 200 mm wafers
PECVD deposition of silicon oxide and silicon nitride
Up to four independent process chambers on the published platform
Centralized wafer transfer between load station and process chambers
Individual chamber configurations can support different film processes
Typical Applications
A P5000 PECVD configuration may be used to deposit dielectric and passivation films such as silicon oxide and silicon nitride. Appropriately equipped chambers may also support amorphous silicon or specialized oxide processes.
The exact film capability depends on the installed chamber type, RF generator, electrode and heater assembly, gas panel, precursor system and process kit. The platform name alone is not sufficient to confirm a particular deposition recipe.
Used Equipment Configuration and Inspection
Before quotation, customers should confirm the number and identification of the installed chambers, wafer-size setup, load station, transfer robot, chamber heaters, RF generators, matching networks, gas panels, MFC ranges, vacuum pumps and process-control software.
The source page lists multiple available systems, but their chamber layouts may not be identical. Current photographs, chamber labels, configuration files and a complete delivery list should be reviewed for the specific machine being offered.
Request Applied Materials P5000 Information
Contact our team to check the current availability of the used Applied Materials P5000 PECVD. Please provide your wafer size, target film, required chamber quantity, deposition process, destination country and expected installation schedule.
Contact us for current equipment photos, chamber configuration, serial numbers, inspection status and quotation.
Frequently Asked Questions
What wafer sizes does the listed P5000 support?
The source listing identifies the available PECVD equipment for 6-inch and 8-inch wafers. The installed wafer-handling hardware must match the required diameter.
How many process chambers can a P5000 have?
The published Precision 5000 platform can support up to four separate process chambers. The actual number installed on a used system may be lower.
What films can the P5000 PECVD deposit?
The listed systems are identified for SiO2 and SiN deposition. Other films require the appropriate chamber, gas system and qualified process recipe.
Are all available P5000 systems configured the same way?
No. Process chambers, wafer size, pumps, gas panels, RF equipment and software can differ between individual machines. Each configuration should be checked separately.