Etching
Removes selected exposed material and transfers the lithographic pattern into the film or wafer.
Pattern transferred into the material
Front-End Wafer Fab Equipment
Semiconductor Etch Equipment and Plasma Etching Systems
Explore used semiconductor etching equipment for material removal, pattern transfer, photoresist removal and related wafer processes. Send a model, nameplate, machine photo, wafer size, material or purchasing requirement to begin reviewing suitable equipment and sourcing options.
Dry and Plasma Etch
RIE and ICP-RIE
DRIE
Asher and Resist Strip
How Etching Transfers a Defined Pattern into the Material
Thin-film deposition forms the material layer, lithography defines the protected and exposed areas, etching removes selected material, and metrology and inspection verify the resulting structure. The exact sequence varies by layer, device architecture and process integration.
Layer Formation
Material Removal
Result Verification
Thin Film Deposition
Creates the dielectric, conductor, metal or semiconductor layer that will be patterned.
Pattern DefinitionLithography
Defines protected and exposed regions in photoresist or a hard mask.
Metrology & Inspection
Checks critical dimension, depth, profile, uniformity and visible process defects.
Available Used Semiconductor Etching Equipment
Browse current used plasma etchers, RIE, ICP-RIE, DRIE, dry etch, asher and resist-strip equipment. Machine configuration, chamber, wafer size, installed options, known condition and delivery scope are confirmed for the specific system.
Equipment Sourcing
Send a Model or Platform Request
Need a platform that is not currently listed?
Send the manufacturer, model, chamber name, nameplate, machine photo or process requirement. We can review active listings, incoming systems and request-based sourcing, then point you toward the most practical next option.
Current Listings
Incoming or Under Review
Sourced by Request
These three paths cover equipment already listed, systems being prepared for quotation, and additional platforms checked through sourcing after inquiry.
Why Buyers Consider Used Etching Equipment
Used equipment can help maintain an existing process platform, replace a failed system, add capacity or source equipment and parts that are no longer available through normal new-equipment channels.
Discontinued Platforms
Continue using an established machine family when new supply has ended but the process remains in production.
Replacement and Capacity
Replace a failed machine or expand a mature-node, MEMS or specialty production line with a familiar platform.
Lower Capital Commitment
Reduce capital investment when a suitable used platform can meet the real process and delivery requirements.
Critical Spare Parts
Identify chamber parts, RF components, MFCs, pumps, valves, chucks, seals or sensors that may help reduce unplanned downtime.
Tell Us What You Need to Find, Replace or Evaluate
You do not need a complete specification to start. Share a model, nameplate, equipment photo, process target, current machine or part number, and we will help define the next practical step.
Equipment Identification
Have a model, nameplate or equipment photo? We can identify the likely platform family and confirm which configuration details should be checked.
Process and Line Requirements
Know the wafer size, material or target result but not the model? We can narrow the relevant equipment range and identify the line conditions that still need verification.
Equipment Sourcing and Replacement
Expanding capacity or replacing an existing tool? Share the current platform and production objective so we can review listed, incoming and sourceable equipment options.
Parts and Platform Support
Need a chamber, module or critical spare? Send the machine model, part number or component photo so we can check supply options and the details that still need confirmation.
One clear starting point is enough.
Discuss an Etching Requirement
Our sourcing and support team can organize the available information, narrow the request, and move the discussion toward equipment, replacement, parts or troubleshooting.
Before Delivery and After Arrival
The quotation and delivery scope should clearly state the specific machine, agreed supporting items, packing and shipping responsibilities, critical spares, warranty and support period.
Confirm the Machine and Order Scope
- Machine and Agreed Items
Confirm the manufacturer, complete model, known condition, current location and the equipment or accessories included in the quotation.
- Deinstallation, Packing and Shipping
State who handles deinstallation, export packing, loading, freight and delivery to the agreed port or site.
- Critical Spares and Support
Review useful spare parts and confirm the warranty, service period, technical support and reporting process for the specific order.
Inspect Before Power-On
- Packaging and Delivery List
Record the unloading condition and visible damage, then verify the machine, chamber, serial number and agreed supporting items.
- Utilities and Installation Conditions
Confirm electricity, gases, vacuum, exhaust, cooling, environmental conditions and transport locks before energizing the system.
- Report Any Abnormal Condition
Provide photos, video, alarm information, serial number, part label and a clear description so the next step can be reviewed.
An experienced technical and service team can continue helping after delivery.
Discuss Support or Spare Parts
When questions appear during receipt inspection, installation preparation, start-up review, alarm checking or spare-part matching, we can help sort the information, review the likely issue direction, and coordinate the next practical step instead of leaving the buyer to resolve everything alone.
Semiconductor Etching Equipment FAQ
Common questions about dry etch, wet etch, RIE, ICP-RIE, DRIE, used equipment and spare parts.
What is the difference between dry etching and wet etching?
Dry etching uses gases, plasma or reactive species, usually in a vacuum chamber. Wet etching uses liquid chemistry in batch, spray or single-wafer equipment. The process profile, selectivity, materials and facility requirements are different.
What is the difference between RIE, ICP-RIE and DRIE?
RIE is a common directional dry-etch approach. ICP-RIE uses a high-density plasma source with more independent control of plasma density and wafer bias. DRIE is mainly associated with deep silicon and high-aspect-ratio structures such as MEMS or TSV applications.
Can you identify an etching system from a photo or nameplate?
A machine photo, nameplate, chamber label, controller screen or part label may be enough to identify the platform family and determine which additional information is useful.
Can a used etcher process our wafer material?
Possibly, but the answer depends on the material, target profile, wafer size, chamber configuration, plasma source, gas delivery, RF system, temperature control and process history of the specific machine.
Can you source an etcher or chamber that is not currently listed?
You can send the target manufacturer, model, chamber name, photo or process requirement. Current availability, sourcing options or possible replacement directions can then be reviewed without assuming compatibility in advance.
Do you supply spare parts for semiconductor etching equipment?
Spare-part requests can be reviewed by manufacturer, model, chamber, part number, label or photo. Availability depends on the specific item and current supply.
Send Your Etching Equipment Requirement
Start with a model, nameplate, machine photo, chamber label, wafer size, material, target etch result, fault description or spare-part number. We can review the equipment direction, current availability and the next technical or commercial step.