Metrology and Inspection Equipment

Used Semiconductor Metrology & Inspection Equipment

Browse used semiconductor inspection and metrology tools for wafer defect detection, critical dimension, overlay, film thickness, surface profile and wafer geometry applications.

Send the manufacturer, model, wafer size and measurement or inspection task. Tool fit depends on the installed optics or e-beam configuration, stage and handler, detectors, software and included options.

Browse Available Equipment Send an M&I Requirement
Wafer Inspection CD and Overlay Metrology Film and Surface Measurement
Current Equipment

02Available Metrology & Inspection Equipment

Browse currently listed semiconductor inspection, review and metrology equipment. Wafer size, sensor architecture, automation, software, accessories and installed options can vary by machine.

Equipment Sourcing

Looking for a Specific Inspection or Metrology Tool?

Send the manufacturer, model, wafer size and target task, such as defect inspection, CD measurement, overlay, film thickness, surface profiling or wafer geometry.

Submit an Equipment Request
Search by Task

03Inspection and Metrology Equipment by Application

Inspection systems locate and review defects or anomalies. Metrology systems measure dimensions, film properties, alignment and wafer geometry. Start with the task that must be completed, then check the actual tool configuration.

Inspection and Review

Find, Locate and Review Defects

Common search directions include optical inspection, wafer surface inspection and higher-magnification defect review.

Unpatterned Wafer InspectionParticles, surface defects and substrate quality on bare or process-monitor wafers
Patterned Wafer InspectionPattern defects, process excursions and front-side inspection on device wafers
Edge and Backside InspectionWafer edge, bevel and backside defects that may affect handling or downstream processing
Defect Review SEMHigh-magnification review and classification of defects located by an inspection system
Wafer Inspection MicroscopesManual or automated optical review with different illumination, magnification and handling options
Metrology and Measurement

Measure Process Dimensions and Material Properties

Metrology tool selection depends on the measurement target, method, wafer format, process layer and required data environment.

Critical Dimension MetrologyCD-SEM, optical CD and related measurement of line width, profile and patterned structures
Overlay and Alignment MetrologyLayer-to-layer alignment and pattern placement measurement for lithography process control
Film Thickness and CompositionOptical film metrology, ellipsometry and other methods for layer thickness or material properties
Surface Profile and TopographyStep height, roughness, 3D surface shape and local feature measurement
Wafer GeometryWafer thickness, flatness, bow, warp, nanotopography and related substrate measurements
Common equipment terms: CD-SEM Review SEM Wafer Inspection System Overlay Metrology Ellipsometer Profilometer Optical Defect Inspection Wafer Inspection Microscope
These categories provide a search direction. A listed tool should not be assumed suitable until the wafer size, sensor or optical architecture, automation, software and available configuration have been reviewed.
Buying Checklist

04Used Metrology & Inspection Equipment Buying Checklist

Review a used M&I tool as a complete system. The model name alone does not confirm wafer handling, sensor configuration, software status, calibration history or included accessories.

01

Measurement or Inspection Task

Define whether the tool must find defects or measure CD, overlay, film, topography or wafer geometry.

Why It Matters

Optical, electron-beam, contact and other methods are designed for different tasks and are not automatically interchangeable.

02

Wafer Size and Automation

Check wafer diameter and thickness, load port, handler, stage and alignment configuration.

Why It Matters

A capable sensor may still be difficult to integrate when the handling path differs from the production flow.

03

Optics, Beam, Detectors and Stage

Review illumination and lenses or the electron source and column, together with detectors, stage and relevant accessories.

Why It Matters

The installed sensor architecture and stage determine the modes available on the specific system.

04

Software and Data Environment

Check software version, recipes, analysis modules, output formats, interfaces and known license status.

Why It Matters

Required analysis, recipe or interface functions may be missing even when the hardware is present.

05

Calibration and Available Records

Request available calibration, reference, maintenance, fault and performance records.

Why It Matters

Records help plan reinspection or calibration, but they do not replace verification on the actual tool.

06

Utilities, Environment and Included Scope

Confirm vacuum, gases, power, cooling and environmental requirements, plus computers, cables, standards and accessories.

Why It Matters

Missing utilities or peripherals can delay installation even when the main tool is suitable.

Important: Used equipment condition, calibration status and measurement performance must be confirmed for the individual machine and agreed service scope.

Discuss a Tool Requirement
Sourcing and Delivery

05M&I Equipment Sourcing and Delivery Scope

The quotation should separate the information available before purchase from the equipment, software, accessories and services included in the final delivery.

01

Equipment Information

Start with the tool identity and measurement or inspection requirement.

  • Manufacturer, model and serial information when available
  • Wafer size, target task and required automation
  • Machine photographs, nameplate and visible options
02

Review and Quotation

Define what can be confirmed from the offered machine and available records.

  • Main tool, handler, stage and installed modules
  • Computer, software, accessories and known license status
  • Available records, packing and optional service scope
03

Final Delivery List

Use the quotation and delivery list as the final scope reference.

  • Included equipment, cables, standards and loose parts
  • Available manuals, media and documentation
  • Excluded items, transport responsibilities and added services
Calibration certification, process setup, installation, on-site support and long-term maintenance are not assumed to be included. Any such service must be confirmed in the quotation or a separate service scope.
Common Questions

06Metrology & Inspection Equipment FAQ

Common questions when reviewing used semiconductor inspection, review and measurement tools.

What is the difference between semiconductor inspection and metrology equipment?

Inspection systems find, locate or classify defects and anomalies. Metrology systems measure dimensions, alignment, film properties, surface features or wafer geometry. Some platforms combine both functions.

Which metrology and inspection equipment types can be requested?

Requests may include wafer inspection systems, inspection microscopes, CD-SEM, review SEM, overlay metrology, film-thickness tools, ellipsometers, profilometers and wafer-geometry systems. Availability must be confirmed for each request.

What information is needed to match a used M&I tool?

Provide the manufacturer or preferred model, wafer size, inspection or measurement task, required automation, process layer or material, and any software or data-interface requirements.

Can the same tool support different wafer sizes?

Used tools may be configured for 150 mm, 200 mm or 300 mm wafers, and some platforms support bridge configurations. The actual handler, stage and load-port arrangement must be checked.

How should calibration and software status be reviewed?

Check available calibration or reference records, software versions, installed analysis modules, recipes, data formats and known license status. A new qualification or calibration may still be required after installation.

Can you help source a tool that is not currently listed?

Submit the manufacturer, model, wafer size and target task. Availability, condition, configuration, documentation, price and lead time must be confirmed for each sourcing request.

Equipment Inquiry

07Send Your Metrology or Inspection Equipment Requirement

Share the manufacturer, model, wafer size, inspection or measurement task, required automation and any important software, handling or facility conditions.

Discuss an M&I Equipment Requirement