The Semiconductor Package Cleaning Machine SC810 is a fully automatic online cleaning system designed for semiconductor package cleaning after soldering and assembly processes. The equipment removes residual flux, organic contamination, and inorganic pollutants from semiconductor devices such as lead frames, IGBT modules, and power semiconductor packages.
In semiconductor packaging manufacturing, soldering processes can leave flux residues and microscopic contaminants on package surfaces. If these residues are not removed effectively, they may cause corrosion, electrical reliability issues, poor adhesion, and long-term package failures.
The SC810 provides an integrated cleaning solution combining chemical cleaning, DI water rinsing, and hot air drying in one automated system. :contentReference.
What is Semiconductor Cleaning Machine SC810?
The SC810 is an automated semiconductor package cleaning machine used for precision cleaning after soldering processes.
Unlike wafer cleaning equipment used before semiconductor fabrication, the SC810 focuses on backend packaging processes where assembled semiconductor devices require contamination removal after welding or soldering.
The machine is designed for high-volume cleaning applications where consistent cleanliness and production efficiency are required.
Why Semiconductor Package Cleaning is Important
After soldering, semiconductor packages may contain different types of contamination:
Flux residues from soldering processes
Organic contaminants
Inorganic particles
Metal residues
Process chemicals
These contaminants can affect semiconductor reliability by causing:
Electrical leakage
Poor bonding performance
Package corrosion
Reduced product lifetime
Failure during reliability testing
SC810 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic semiconductor package cleaning machine |
| Main Application | Post-solder semiconductor package cleaning |
| Cleaning Method | Spray cleaning |
| Cleaning Process | Chemical cleaning + DI water rinse + hot air drying |
| Target Contamination | Flux residue, organic and inorganic pollutants |
| Control System | PLC control system |
| Applications | Lead frame, IGBT, power module, semiconductor package |
SC810 vs Plasma Cleaning System
| Equipment | Main Function |
|---|---|
| SC810 Semiconductor Cleaner | Remove flux and physical contamination after soldering |
| Nordson / Panasonic Plasma Cleaner | Surface activation and molecular contamination removal |
The two technologies are complementary. Plasma systems improve surface energy before bonding, while SC810 focuses on removing post-solder contamination after semiconductor package assembly.
Maintenance Considerations
Check spray nozzle condition
Maintain chemical concentration
Monitor DI water quality
Clean filtration system regularly
Inspect drying airflow performance
For used SC810 equipment evaluation, important inspection points include pump condition, spray system performance, control system status, and cleaning repeatability.
Summary
The Semiconductor Package Cleaning Machine SC810 provides an automated solution for removing flux residues and contamination from semiconductor packages after soldering processes.
With integrated spray cleaning, DI water rinsing, drying technology, and automated process control, the SC810 helps semiconductor manufacturers improve package cleanliness, production efficiency, and final product reliability.
