Used Semiconductor Assembly Equipment
Source used ASM and ASMPT die bonders with model verification, installed-configuration review, machine inspection, tooling confirmation, export preparation and international delivery support. Every project is assessed against the actual die, wafer, carrier, bonding process and production requirement.
A listing for a used ASM die bonder should identify more than the manufacturer and model. The same ASM or ASMPT platform may have been built for a different wafer size, die attach process, material input, carrier format or factory interface.
The machine may also be offered under very different supply conditions. One unit may be available exactly as removed from production, while another may have been cleaned, powered on, function-tested or prepared using representative production materials.
Before requesting a final quotation, the buyer and supplier should clarify:
This approach reduces the risk of buying a machine with the correct model name but the wrong configuration. It also creates a clearer basis for comparing the price of different used ASM die bonders.
For a broader explanation of ASM platforms and die attach processes, visit our ASM die bonder machine guide.
Model availability changes. The cards below represent platform families that may be evaluated for sourcing, not a guarantee that every model is currently in stock.
A high-speed silver-epoxy die bonding platform designed around wafer-to-leadframe processing. Actual loaders and epoxy modules must be checked.
A mature ASM automatic die bonding platform that may remain relevant for established lines using compatible tooling and production recipes.
A precision-oriented die bonding platform whose application suitability depends on the configured process modules, optics and tooling.
An automatic ASM die bonding platform that should be assessed according to die handling, process modules and the actual production package.
An automatic die bonding platform commonly evaluated for established semiconductor assembly requirements, subject to exact configuration verification.
A configurable automatic die bonding system. Its real process range must be confirmed from the installed heads, modules, software and tooling.
A clear quotation should describe the work completed on the specific machine instead of relying on vague labels such as “good condition” or “fully refurbished.”
The machine may be supplied in the condition in which it was removed from a production site or storage location.
The machine is cleaned and selected functions are checked according to an agreed inspection list.
Selected service work and a defined test procedure are completed before shipment.
A structured sourcing process helps separate machine availability from application suitability.
Provide the model, process, die, wafer, carrier and destination information.
Search available machines and acceptable alternative configurations.
Check model, serial number, year, photographs and installed modules.
Define power-on, functional, tooling or sample-production checks.
Clean, secure modules, protect optics and complete export packing.
Coordinate loading, shipping and agreed installation assistance.
The following factors should be compared before deciding that one quotation is more competitive than another.
Age can affect control hardware, software compatibility, parts availability and machine condition.
Loaders, dispensing modules, heaters, optics and factory interfaces can significantly change value.
Storage history, production use, contamination, collision damage and maintenance affect service requirements.
A power-on check is not the same as module testing or sample-production verification.
Collets, ejector tools, anvils, magazines, clamps and calibration fixtures may be package-specific.
Replaced motors, cameras, sensors, computers, boards or pneumatic parts affect the final scope.
Cleaning, dismantling, securing, moisture protection, wooden cases and loading add project costs.
On-site commissioning, remote assistance, operator guidance and travel must be defined separately.
Use the sections below to define which parts of the machine should be checked before final order confirmation.
Confirm that all photographs, test videos and supply documents refer to the machine being quoted.
Movement should be checked for alarms, abnormal noise, vibration, repeatability and previous collision signs.
The actual input and output configuration must match the customer's wafer, leadframe, substrate or package carrier.
A visible image does not confirm recognition stability. Camera, lighting and process-recognition functions should be checked together.
The control system should start normally and communicate with the machine modules without recurring faults.
A production test should be based on agreed materials and measurable acceptance points.
The ASM AD830 Plus is frequently searched by companies replacing an existing machine or adding capacity to an established silver-epoxy die attach line. It is a fully automatic wafer-to-leadframe die bonding platform whose production flow can include leadframe loading, silver-epoxy application, die pickup, placement, inspection and output handling.
When comparing used AD830 Plus machines, confirm the physical machine rather than relying on a general model specification. The input system, silver-epoxy module, wafer loading arrangement, tooling and software can differ between units.
A used semiconductor machine must be prepared for movement and long-distance transport according to its structure and installed modules.
Remove process residue, secure moving assemblies, protect cameras and separate loose tools or accessories.
Use moisture protection, sufficient desiccant, reinforced base support and a suitable export wooden case.
Confirm machine dimensions, weight, lifting position, truck access, container selection and loading method.
Prepare the agreed packing list, commercial documents and machine-identification records for delivery.
Check power, compressed air, environmental conditions, floor space, doorway clearance and service access.
Clarify machine startup, available backups, included tooling and the agreed installation or remote-support scope.
A detailed request helps us reject unsuitable machines early and focus on the models and configurations that can realistically support your process.
Common questions about machine availability, condition, pricing, inspection and international delivery.
Used ASM and ASMPT die bonder availability changes regularly. Provide the required model, process, configuration and destination so that suitable machines or acceptable alternatives can be checked.
Projects may involve AD830 Plus, AD800, AD819, AD50Pro, AD8312 Plus, AD832i and other ASM or ASMPT platforms. Availability and configuration must be confirmed for each request.
Price depends on the exact model, year, machine condition, installed modules, included tooling, inspection level, service work, export packing, delivery and installation scope.
The word refurbished is only useful when the completed work is documented. Compare which parts were replaced, which modules were tested and whether representative production materials were used.
Testing can be arranged according to machine condition and project scope. Possible levels include power-on checks, module testing, video inspection or sample-production testing where suitable materials are available.
Provide the die, wafer, leadframe or substrate, bonding material, inspection requirement and output target. These details can then be compared with the actual installed machine configuration.
Tooling is not automatically included unless stated in the quotation. Collets, ejector tools, anvils, clamps, magazines, wafer frames and calibration tools should be listed individually.
Part matching can be checked according to availability. Provide the old part number, machine model, serial number, installed-position photographs, connector details and physical dimensions.
International delivery can include machine preparation, moving-part protection, moisture-resistant packing, reinforced wooden cases, loading and freight coordination according to the project.
Send the required model, machine condition, die and wafer information, leadframe or substrate drawing, bonding process, target output, test requirements and destination country.
Send your required ASM die bonder model and production information. We will review possible equipment, installed options, testing requirements and delivery conditions before preparing a quotation.