The Besi Datacon 8800 CHAMEO ultra is an ultra-high-precision flip chip bonding system designed for advanced semiconductor packaging applications requiring sub-micron alignment and thermocompression bonding stability.
It is used in heterogeneous integration, silicon photonics, and high-density interconnect manufacturing where conventional flip chip tools cannot meet alignment or thermal stability requirements.
What is the CHAMEO ultra Used For?
Sub-micron flip chip die attach
Thermocompression bonding (TCB)
2.5D / 3D heterogeneous integration
Fine-pitch micro-bump interconnect assembly
Key Applications
Silicon photonics modules
AI / HPC chiplet packaging
5G RF front-end modules
VCSEL / photodiode arrays
Technical Highlights
Sub-micron vision alignment system
Localized thermocompression heating
Closed-loop bond force control
Flux / fluxless process compatibility
Process Flow Integration
Wafer bumping → Dicing → Flux application → Flip chip placement → TCB bonding → Underfill → Curing → Testing
Competitive Positioning
Higher precision than standard epoxy bonders
More flexible than dedicated high-volume flip chip lines
Optimized for high-mix advanced packaging production
Technical Specifications
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±0.5–1.0 μm @ 3σ |
| Bonding Type | TCB / Mass reflow / Fluxless |
| Wafer Support | Up to 12-inch |
| Substrate Types | Organic / Ceramic / Interposer |
Why Manufacturers Use It
Improves yield in fine-pitch interconnects
Enables chiplet and heterogeneous integration
Supports optical + RF + logic co-packaging
Frequently Asked Questions
What makes it different from standard bonders?
It provides sub-micron alignment combined with strict thermocompression control, which standard high-volume epoxy or mass reflow bonders cannot achieve.
Can it handle fluxless bonding?
Yes, with a controlled atmosphere configuration, the system supports fluxless bonding processes critical for optical and sensitive semiconductor devices.
Summary
The system is optimized for next-generation advanced packaging where precision, thermal control, and heterogeneous integration capability are critical.
Request Specification or Quotation
System configuration sheet
Process compatibility analysis
Integration support
Contact / Inquiry Section
