The ASM LS100-2 is an automatic laser scribing system used for compatible semiconductor and LED wafer processing. It applies laser energy along defined streets or processing paths before wafer separation or in other compatible laser-cutting applications.
The actual laser source, optical setup, wafer-handling system, worktables and software functions depend on the specific pre-owned machine available. For an initial inquiry, send your current cutting-machine model, clear photos of the wafer or substrate and a short description of the required scribing or cutting process.
ASM LS100-2 Machine Information
| Manufacturer | ASM / ASMPT |
|---|---|
| Model | LS100-2 |
| Equipment Type | Automatic laser scribing and wafer-processing system |
| Primary Application | Laser scribing and compatible cutting processes for semiconductor or LED substrates |
| Workpiece Compatibility | Determined by the substrate material, wafer format, thickness, street layout and installed laser configuration |
| Condition | Pre-owned semiconductor laser-processing equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
Laser Scribing and Wafer Processing
The LS100-2 moves a wafer or substrate beneath a focused laser beam and processes programmed paths according to the product recipe. Depending on the application, the laser may create a controlled scribe or trench that supports a later separation step, or perform another compatible material-removal process.
Process results depend on more than the machine model. The laser source, wavelength, optics, focus position, processing speed, substrate material and wafer condition all affect the width, depth and consistency of the processed path.
Wafer and Process Compatibility
The LS100-2 model name does not by itself confirm compatibility with a particular wafer or substrate. The available machine must be reviewed against the material, wafer size, thickness, street width, surface structure, required processing depth and downstream separation method.
Only basic information is needed for the first discussion:
- Your current laser, dicing or scribing-machine model if the LS100-2 will replace existing equipment
- Clear photos of the wafer, substrate or processed product
- A close-up photo of the cutting street or current scribe result where available
- A short description of the required process or current cutting problem
Detailed wafer drawings, material specifications, street dimensions and process parameters can be reviewed later when the available machine appears relevant to the project.
Available LS100-2 Configuration and Delivery Scope
Individual ASM LS100-2 systems may differ in laser source, optical components, worktables, wafer loading, alignment cameras, focus measurement, process monitoring, control software and exhaust arrangements. Before purchase, the available machine should be reviewed to confirm whether its actual laser and wafer-handling configuration is suitable for the intended material and process. The final delivery scope is based only on the quotation and confirmed equipment list; laser-source accessories, chillers, vacuum pumps, wafer cassettes, frames, fixtures, computers, software and external exhaust equipment are included only when specifically stated.
Receiving, Startup and Initial Cutting Trial
The LS100-2 should be inspected and tested in stages before valuable production wafers are introduced.
- Inspect the packing, machine cabinet, laser enclosure, worktables, control panel and visible wafer-handling mechanisms.
- Photograph any impact marks, loose components, damaged cables or displaced assemblies before moving the equipment.
- Compare the received machine, chiller, fixtures, wafer-handling parts and accessories with the confirmed delivery list.
- Check that the optical assemblies, worktables, cameras and handling mechanisms remain secured after transportation.
- Confirm the electrical supply, grounding, cooling, compressed air, vacuum and exhaust requirements of the actual machine.
- Start the controller and record all alarm messages before resetting the system or changing process parameters.
- Run the loading, table movement, alignment and focus-related functions without a production wafer.
- After basic movement is stable, use a suitable non-production wafer or substrate for an initial laser-processing trial.
Begin with a conservative test recipe and inspect the processed path before repeating the cycle. Stop testing if the table movement is abnormal, alignment is unstable, the laser does not operate consistently or the same alarm repeatedly returns.
Cutting Results, Alarms and Parts Support
Irregular scribe depth, excessive heat effect, chipping, wide processing paths or incomplete material removal may involve focus position, laser output, optics, substrate flatness, process speed, wafer alignment or unsuitable recipe settings.
Position errors may also involve the worktable, vision alignment, wafer holding, edge detection or incorrect product data. These causes should be reviewed before adjusting the laser recipe repeatedly.
Record the alarm message and the stage at which the problem occurs before resetting the machine. Photos of the wafer, processed street, worktable and alarm screen, together with a short operating video where available, can provide a practical starting point for review.
Our team can assist with initial fault analysis, component identification, replacement-part matching and repair discussion. Related sensors, motors, drivers, boards, cables, cameras, vacuum parts, motion components and wafer-handling assemblies can also be checked where available.
Frequently Asked Questions
Can the ASM LS100-2 process our wafer or substrate?
This depends on the material, wafer dimensions, thickness, street layout, required processing depth and laser configuration of the available machine. Send wafer and process-result photos for an initial review.
Is the LS100-2 a laser scriber or a laser cutting machine?
The LS100-2 is commonly identified as an automatic laser scribing system. Whether it performs partial-depth scribing or another compatible cutting process depends on the installed laser setup and production recipe.
Is the laser source included with the machine?
Only the laser source, power equipment, cooling components and related accessories specifically listed in the quotation or confirmed delivery scope are included.
Can the machine use our existing wafer frames or fixtures?
Compatibility must be checked using the wafer format, frame or fixture dimensions, loading arrangement, table setup and alignment method.
Can you assist with alignment, focus or cutting-quality problems?
Yes. Send the machine model, alarm information, wafer photos, close-up images of the processed path and an operating video where available. We can assist with initial fault review, parts matching and repair discussion.
Contact Us About the ASM LS100-2
Send your current laser or dicing-machine model, wafer or substrate photos and a short description of the required scribing process or equipment problem. We will review the basic application first and continue with the necessary laser configuration, wafer handling, replacement-parts or repair details afterward.
