The SAMCO PD-3800L is a load-lock plasma-enhanced chemical vapor deposition system designed for batch deposition of silicon-based thin films. Multiple wafers are placed on a large carrier tray and processed together in the reaction chamber.
Published applications include silicon oxide, silicon nitride, silicon oxynitride and amorphous silicon deposition. The system is intended for applications requiring batch productivity, film uniformity, stress control and repeatable processing.
SAMCO PD-3800L Main Specifications
| Manufacturer | SAMCO |
|---|---|
| Model | PD-3800L |
| Equipment Type | Load-Lock Batch PECVD System |
| Deposition Technology | Plasma-enhanced chemical vapor deposition |
| Maximum Processing Area | Approximately 360 mm diameter carrier-tray area |
| Published Wafer Loading | Up to 9 × 3-inch, 6 × 4-inch or 3 × 6-inch wafers, depending on the carrier tray |
| Published Film Materials | SiO2, SiN, SiON and amorphous silicon |
| Published Process Examples | SiH4-SiNx, SiH4-SiO2, liquid-precursor SiNx and TEOS-SiO2 |
| Wafer Loading | Load-lock chamber with tray-based batch processing |
| Control Interface | Touch-screen parameter control and recipe storage in the published platform |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, carrier configuration and inspection confirmation |
Key Equipment Features
Batch processing of multiple wafers on a large carrier tray
Load-lock chamber for improved process stability
Published support for silicon oxide, nitride, oxynitride and amorphous silicon films
Designed for film uniformity and stress control across the carrier area
Recipe storage and touch-screen process control
Optional automatic wafer transfer was offered for the platform
Typical Applications
The PD-3800L can be used for depositing insulating, dielectric and passivation films in silicon and compound-semiconductor processing. Its large tray is particularly useful when several smaller wafers need to be processed in the same deposition run.
The actual wafer count depends on the installed carrier tray. Film material, deposition rate, thickness uniformity and stress performance depend on chamber condition, electrode configuration, gas delivery, RF components, temperature control and the qualified recipe.
Used Equipment Configuration and Inspection
Before quotation, customers should confirm the carrier-tray diameter and wafer layout, load-lock operation, chamber condition, RF generator, matching network, substrate heating, gas box, MFC ranges, liquid-precursor delivery system and vacuum pumps.
Automatic transfer equipment was available as an option and should not be assumed to be included. The final delivery scope should identify the main system, pumps, gas equipment, tray, control computer and all external cabinets.
Request SAMCO PD-3800L Information
Contact our team to check the current availability of the used SAMCO PD-3800L. Please provide your wafer size, number of wafers per batch, target film, process chemistry, destination country and installation schedule.
Contact us for equipment photos, carrier-tray configuration, chamber history, inspection status and quotation.
Frequently Asked Questions
What films can the PD-3800L deposit?
Published applications include SiO2, SiN, SiON and amorphous silicon. The installed gas and precursor configuration must support the requested film.
Is the PD-3800L a single-wafer system?
No. It is designed for tray-based batch processing of multiple wafers in one reaction chamber.
How many wafers can fit on the carrier tray?
SAMCO lists configurations including 9 × 3-inch, 6 × 4-inch or 3 × 6-inch wafers. The exact capacity depends on the carrier supplied with the used machine.
Does every PD-3800L include automatic wafer transfer?
No. Automatic cassette-to-tray transfer was offered as an option. Its presence must be verified on the available equipment.
