The KAIJO FB-i28 is a fully automatic high-precision wire bonding system designed for advanced semiconductor packaging nodes requiring fine-pitch interconnect formation, stacked-die routing, and low-stress thermosonic bonding control.
It is widely deployed in OSAT and IDM environments where copper wire adoption, sub-40 μm pad pitch scaling, and multi-tier loop control are critical to yield stability and package reliability.
1. System Overview & Process Positioning
The FB-i28 operates as a backend electrical interconnect formation platform following die attach. It establishes first and second bond connections using thermosonic energy transfer combined with precision force modulation.
The system is optimized for fine-pitch applications requiring stable intermetallic compound (IMC) formation while minimizing mechanical stress on low-k dielectric structures.
2. Core Process Modules
Thermosonic Bonding Control: Combines ultrasonic energy and thermal activation to ensure stable ball bond and stitch bond formation across Au, Cu, and PCC wire systems.
Closed-Loop Force Regulation: Real-time bond head feedback control minimizes pad cratering risk and maintains consistent bond deformation profiles.
EFO (Electronic Flame-Off) System: Ensures stable free-air ball (FAB) formation for copper and gold wire processes with oxidation compensation control.
High-Resolution PRS Vision System: Pattern recognition system compensates for substrate shift, warpage, and fiducial misalignment during high-speed operation.
3. Looping Architecture & Mechanical Control
The FB-i28 supports advanced wire loop geometries required for stacked-die and multi-chip module (MCM) packaging.
M-shaped loop profiles for multi-tier clearance
Reverse loop routing for dense SiP integration
Squared loop control for high wire density packages
Dynamic loop tuning ensures stable loop height, reduces wire sweep during molding, and improves mechanical robustness in high-density packaging environments.
4. Application Domains
Advanced Memory & Logic Packaging
DRAM / NAND high-density packages
Application processors (AP)
System-in-Package (SiP) and multi-chip modules (MCM)
Stacked Die Architectures
3D memory stacking interconnects
Sensor + logic heterogeneous integration
Power Semiconductor Devices
Power MOSFET and PMIC packaging
High-current copper wire interconnect systems
5. Technical Specifications (Engineering Range)
| Parameter | Specification |
|---|---|
| System Type | Fully automatic high-precision wire bonder |
| Wire Materials | Au / Cu / PCC |
| Bonding Accuracy | ±1.5 μm to ±2.5 μm @ 3σ |
| Minimum Pad Pitch | Sub-40 μm class capability |
| Wire Diameter Range | 15 μm – 50 μm |
| Substrate Types | Leadframe / organic laminate / strip carriers |
| Throughput | Optimized for high-yield advanced packaging production |
6. Process Flow Integration
Wafer dicing → Die attach → Wire bonding (FB-i28) → Encapsulation (molding) → Singulation → Final test
7. Engineering Evaluation
Low-k dielectric reliability management
The system reduces pad cratering risk through controlled ultrasonic energy delivery and adaptive bond force modulation, ensuring mechanical integrity on advanced nodes.
Stacked-die routing capability
Multi-tier loop control enables clearance over die stacks while maintaining stable loop geometry and minimizing wire sweep during molding.
Cu wire process adaptation
Optimized EFO and forming gas compatibility support copper oxidation control and stable free-air ball formation.
8. Summary
The KAIJO FB-i28 delivers a balanced solution for advanced wire bonding in fine-pitch, stacked-die, and copper wire adoption environments. It combines precision force control, adaptive loop shaping, and high-speed vision alignment to support next-generation semiconductor packaging requirements.
9. Request Technical Specification or Quotation
Equipment specification sheet
Copper / Gold wire process evaluation
Looping strategy configuration
Production line integration support
Contact engineering team for evaluation or quotation support.
