The ThinkLaser SC300 is an automated semiconductor wafer laser marking system developed for permanent identification and traceability marking on 300 mm silicon wafers.
Designed specifically for high-volume semiconductor manufacturing, the SC300 combines debris-free soft marking, automated wafer handling, optical alignment, production recipe management and factory communication in one integrated platform.
Unlike conventional hard-marking equipment that creates deeper marks on the wafer surface, the SC300 uses a controlled soft-marking process. This produces shallow, readable dot-matrix marks while minimizing particle generation and unnecessary surface disturbance.
The equipment is suitable for semiconductor fabs, silicon wafer manufacturers, foundries, wafer reclaim operations and other facilities requiring reliable 300 mm wafer identification in a controlled cleanroom environment.
Permanent Identification for 300 mm Semiconductor Wafers
Modern semiconductor wafers pass through multiple fabrication, inspection, cleaning, measurement and material-handling processes.
A permanent wafer identification mark allows each physical wafer to remain connected to its production lot, process history, quality records and manufacturing data.
The ThinkLaser SC300 can apply information such as:
Wafer identification numbers
Production lot numbers
Batch numbers
Serial numbers
Manufacturing codes
Process tracking information
Dot-matrix characters
Barcodes
Two-dimensional data matrix codes
Customer-specific wafer IDs
Factory traceability information
Because the identification is marked directly onto the wafer surface, it does not depend on labels, ink or other removable identification methods.
Debris-Free Wafer Soft Marking
The SC300 is designed around a low-debris soft-marking process for polished semiconductor wafers.
Soft marking creates shallow permanent marks while reducing particle generation compared with conventional deep laser engraving. This makes the equipment suitable for applications where cleanroom compatibility and wafer-surface control are important.
The soft-marking process helps support:
Permanent wafer identification
Reduced particle generation
Controlled wafer-surface modification
Consistent dot formation
Stable character readability
Automated wafer traceability
Cleanroom production requirements
High-volume semiconductor manufacturing
Marking performance depends on the wafer material, laser condition, optical configuration and selected production recipe.
SuperSoftMark Technology
The ThinkLaser SC300 uses SuperSoftMark technology to create controlled dot-matrix marks on polished silicon wafers.
The process combines a stable diode-pumped laser, precision focusing optics and system-level process control to maintain consistent marking results.
Representative marking depth is approximately 2.4 μm, with configurable process depth available according to the installed laser and recipe.
The SuperSoftMark process is designed to provide:
Shallow permanent marks
Low marking debris
Consistent dot depth
Controlled dot diameter
High character readability
Reduced wafer contamination risk
Repeatable production results
Stable marking across multiple wafer lots
The final process parameters should be qualified using the customer’s intended wafer material and downstream manufacturing process.
Dedicated 300 mm Wafer Processing
The SC300 is primarily designed for automated processing of 300 mm semiconductor wafers.
A representative system includes two 300 mm cassette ports, an optical wafer aligner and an automated pick-and-place robot with a single end effector.
Typical wafer-handling components may include:
Two 300 mm cassette-loading ports
Automated wafer-loading system
Pick-and-place wafer robot
Single robot end effector
High-resolution optical wafer aligner
Automatic wafer positioning
Automated laser-marking sequence
Automatic wafer unloading
Some system configurations may include an optional 200 mm bridge capability. The actual installed wafer-size hardware should be verified before purchasing an available machine.
Optional 200 mm Wafer Bridge Capability
Although the SC300 is primarily configured for 300 mm wafers, selected machines may include optional hardware for processing 200 mm wafers.
The availability of 200 mm capability depends on the system configuration and may require:
Wafer-size bridge hardware
Compatible cassette adapters
Robot end-effector changes
Wafer-aligner configuration
Software recipe support
Wafer-handling qualification
The model name alone does not confirm that a machine can process both 200 mm and 300 mm wafers.
Buyers should inspect the actual installed hardware, accessories and software before purchase.
Polished Silicon Wafer Compatibility
The standard SC300 application is soft marking on polished, non-coated, pure silicon wafers.
Representative compatible materials include:
Polished silicon wafers
Prime silicon wafers
Monitor wafers
Test wafers
Process-development wafers
Selected reclaimed silicon wafers
Compatibility with coated wafers, patterned wafers or specialty semiconductor substrates should be evaluated separately.
Application testing is recommended before processing:
Silicon carbide wafers
Gallium arsenide wafers
Glass substrates
Sapphire wafers
Coated silicon wafers
Transparent semiconductor materials
Compound-semiconductor wafers
Mark quality may vary according to the substrate material, surface finish, coating, laser absorption and required mark depth.
SEMI-Compatible Wafer Marking
The SC300 is designed to support wafer identification formats used in semiconductor manufacturing.
Representative compatibility includes SEMI T7, M12 and M13 marking requirements.
Standard marking formats may include:
5 × 9 SEMI single-density dot matrix
9 × 17 single-density dot matrix
10 × 18 double-density dot matrix
T1 BC-412 barcode
T7 two-dimensional data matrix
M12 character formation
M13 character formation
User-selectable checksum
Custom marking fonts
Depending on the selected character format and layout, the system may support up to 80 characters in one marking group.
The required marking format should be confirmed against the software version installed on the available equipment.
Straight-Line and Arc Marking
The ThinkLaser SC300 can produce dot-matrix marks in straight-line or arc-shaped layouts.
Straight-line marking can be used for conventional character strings, wafer IDs and production codes.
Arc marking allows the identification content to follow the curved circumference of the wafer.
Available layout options may include:
Straight wafer ID marking
Arc-shaped wafer-edge marking
Multiple marking groups
Different character orientations
Primary and secondary identification groups
Customer-defined marking positions
Machine-readable code placement
Multiple marking groups can be positioned at different orientations within a defined area around the wafer circumference.
Controlled Marking Location
The SC300 can place identification marks within a band around the wafer circumference.
Representative marking location is within approximately 25 mm of the wafer edge.
This allows production engineers to control the relationship between the identification mark and active wafer areas.
Marking-position control helps support:
Consistent wafer ID placement
Reduced interference with device areas
Repeatability between wafers
Compatibility with wafer-edge inspection
Standardized factory marking layouts
Multiple identification groups
Accurate arc-mark positioning
The final marking location should be selected according to the wafer design and production requirements.
Optical Wafer Alignment
Accurate marking requires the wafer position and orientation to be identified before the laser process begins.
The SC300 uses a high-resolution optical wafer aligner to establish the wafer reference and control mark placement.
Optical alignment can help manage:
Wafer orientation
Notch position
Marking angle
Distance from the wafer edge
Straight-line mark position
Arc-mark position
Placement of multiple marking groups
Repeatability across production batches
Representative mark-position repeatability is approximately ±75 μm in the X and Y directions relative to the primary wafer reference.
Actual positioning performance depends on the aligner condition, robot calibration, wafer condition and system maintenance.
Controlled Dot Diameter and Depth
Consistent dot dimensions are important for readable and repeatable wafer identification.
Representative SC300 marking specifications include:
Dot diameter of approximately 50–70 μm
Dot-diameter tolerance of approximately ±10%
Dot depth of approximately 2.4 μm
Configurable process depth up to approximately 5 μm
Dot-roundness ratio below approximately 1.1
Available laser spot sizes may include:
50 μm
60 μm
70 μm
The installed optical configuration determines which spot sizes are available on an individual machine.
Stable Dot Formation
Each wafer ID character is formed from a group of controlled laser-generated dots.
Variations in dot size, depth or shape may reduce readability and affect automated character recognition.
The SC300 combines stable laser pulses, flat-field focusing optics and closed-loop control to help maintain:
Consistent dot diameter
Controlled dot depth
Uniform dot shape
Stable laser pulse energy
Repeatable character formation
Reliable mark contrast
Production-to-production consistency
Machine-readable identification quality
Actual results depend on the wafer surface, laser condition, optical alignment and production recipe.
High-Volume Automated Production
The ThinkLaser SC300 is designed for automated semiconductor production rather than manual wafer loading.
The cassette ports, wafer robot, optical aligner and laser system operate as a coordinated production platform.
Representative throughput is approximately 125 to 180 wafers per hour under specified conditions using:
Single-pulse marking
A 5 × 9 dot-matrix format
A 12-character identification mark
Machines equipped with optional edge-handling functions may have representative throughput of approximately 70 to 110 wafers per hour under similar marking conditions.
Actual throughput depends on:
Marking character quantity
Selected font
Marking depth
Number of marking groups
Wafer-alignment time
Robot movement
Cassette-loading sequence
Host communication
Edge-handling requirements
Equipment condition
Production capacity should be evaluated using the intended wafer recipe.
Automated Wafer Transport
The SC300 uses an automated pick-and-place robot to transport wafers between the cassette ports, aligner and laser-marking position.
Automated wafer transport helps reduce manual handling and supports repeatable wafer positioning.
A representative wafer-handling sequence may include:
Wafer selection from the cassette
Automated wafer pickup
Transfer to the optical aligner
Wafer orientation and reference detection
Transfer to the laser-marking position
Execution of the selected marking recipe
Return of the marked wafer to the cassette
The robot, end effector and aligner should be inspected when evaluating a used SC300 system.
Closed-Loop Laser Control
The SC300 combines its laser source with system-level closed-loop control.
This allows the equipment to monitor laser operation and maintain consistent marking performance during production.
Closed-loop control may help manage:
Laser pulse stability
Marking-energy consistency
Dot-depth control
Dot-diameter stability
Production recipe repeatability
Process variation
Laser-performance tracking
Preventive maintenance planning
Representative laser pulse stability is below approximately 0.5% at 1 kHz.
The actual performance of an available machine should be verified through inspection and marking tests.
Automated Process Data Logging
The SC300 can record laser and system-performance information to support production monitoring and statistical process control.
Available data-management functions may include:
Laser-performance records
Marking job history
Process recipe storage
Production quantity records
Fault and alarm logs
Equipment diagnostic information
Marking-quality data
System-status monitoring
Automated data logging helps manufacturing teams investigate process variation and maintain traceable production records.
Production Recipe Management
Different wafer products may require different identification formats, marking positions and process settings.
The SC300 allows operators to create and store multiple job files.
A marking recipe may contain:
Wafer size
Identification content
Dot-matrix format
Character quantity
Marking position
Marking orientation
Laser spot size
Marking depth
Cassette assignment
Production quantity
Host communication settings
Stored recipes help operators repeat qualified marking processes across multiple wafer lots.
SECS II/GEM Factory Integration
The ThinkLaser SC300 can include a SECS II/GEM communication interface for integration with semiconductor factory systems.
A compatible factory host or manufacturing execution system may use this interface for:
Equipment-status monitoring
Production job transfer
Remote recipe selection
Processing commands
Alarm reporting
Event monitoring
Production-data collection
Wafer tracking
Host-controlled operation
Factory automation management
The installed communication hardware, software version and licensing status should be verified before purchasing an available machine.
Laser and Optical System
Representative SC300 systems use an acousto-optic Q-switched, diode-pumped Nd:YLF laser.
Typical laser and optical characteristics include:
Diode-pumped laser source
Q-switched pulse generation
TEM00 beam mode
Approximately 1053 nm wavelength
Flat-field focusing lens
Stable pulse-to-pulse performance
Configurable laser spot sizes
Closed-loop process control
Programmable soft-marking parameters
Before purchasing a used SC300, buyers should verify:
Laser model
Laser serial number
Laser operating hours
Laser-output condition
Pulse stability
Beam quality
Optical-lens condition
Spot-size configuration
Laser cooling condition
Controller compatibility
Marking test results
Cleanroom-Compatible Equipment Design
The SC300 is designed for semiconductor cleanroom installation.
A representative system uses a stainless steel enclosure compatible with an ISO Class 5 cleanroom and an ISO Class 2 mini-environment around the controlled wafer-processing area.
Cleanroom-oriented design features may include:
Stainless steel equipment enclosure
Enclosed laser-marking area
Controlled wafer-handling environment
Mark-point exhaust connection
Process vacuum connection
Static-charge control
Automated wafer transfer
Reduced manual wafer contact
The suitability of an available machine should be evaluated according to its condition and the customer’s specific cleanroom standards.
Representative System Dimensions and Weight
Representative SC300 dimensions are:
Height: approximately 1981 mm
Width: approximately 1641 mm
Depth: approximately 1204 mm
Representative equipment weight may include:
Equipment front-end module: approximately 671 kg
Marking enclosure: approximately 519 kg
Actual dimensions and weight should be confirmed before planning transportation, cleanroom access and installation.
Representative Utility Requirements
Facility requirements may vary according to the exact equipment configuration.
Representative requirements include:
Electrical supply: 200–240 VAC
Phase: Single phase
Frequency: 50/60 Hz
Rated current: Approximately 23 FLA
Process vacuum: Required
Mark-point exhaust: Required
Maximum mark-point exhaust flow: Approximately 20 CFM
Exhaust-port diameter: Approximately 50.8 mm
Operating temperature: Approximately 12.8–27°C
Network connection: Required for host communication
All facility requirements should be confirmed from the equipment documentation before installation.
Main Equipment Features
Dedicated 300 mm semiconductor wafer marking
Optional 200 mm bridge capability
Debris-free soft-marking process
SuperSoftMark technology
Permanent wafer identification
Polished silicon wafer processing
Straight-line marking
Arc-shaped marking
Multiple marking-group placement
SEMI-compatible character formats
Dot-matrix marking
Barcode marking
Two-dimensional data matrix marking
Controlled dot diameter
Shallow marking depth
Optical wafer alignment
Automated wafer loading and unloading
Two 300 mm cassette ports
Pick-and-place wafer robot
Closed-loop laser control
Automated process data logging
Multiple job-file storage
Fault and error logging
SECS II/GEM factory communication
Cleanroom-compatible construction
High-volume production capability
Representative Technical Specifications
The following information is representative only. The actual available equipment should be inspected and verified before purchase.
Marking method: Dot-matrix laser soft marking
Marking layouts: Straight line and arc
Primary wafer size: 300 mm
Optional wafer capability: 200 mm bridge
Wafer material: Polished, non-coated, pure silicon
Dot diameter: Approximately 50–70 μm
Dot-depth reference: Approximately 2.4 μm
Configurable process depth: Approximately 2.4–5 μm
Dot roundness: Below approximately 1.1 major-to-minor axis ratio
Maximum characters: Up to 80 characters per group
Marking field: Approximately 50 × 50 mm after alignment
Mark location: Within a 25 mm band around the wafer circumference
Mark repeatability: Approximately ±75 μm in X and Y
Wafer alignment: High-resolution optical aligner
Wafer transport: Pick-and-place robot with single end effector
Cassette ports: Two 300 mm ports
Laser type: Q-switched, diode-pumped Nd:YLF
Laser wavelength: Approximately 1053 nm
Spot sizes: Approximately 50, 60 or 70 μm
Standard throughput: Approximately 125–180 wafers per hour
Optional edge-handling throughput: Approximately 70–110 wafers per hour
Factory communication: SECS II/GEM
Certification configuration: CE and applicable SEMI requirements
Equipment Configuration to Confirm
SC300 systems may have different hardware and software configurations according to manufacturing year and original production application.
Before purchasing, buyers should confirm:
Equipment manufacturing year
Machine serial number
Current operational condition
Laser model
Laser operating hours
Laser-output condition
Supported wafer size
Optional 200 mm bridge hardware
Cassette-port condition
Cassette compatibility
Robot condition
End-effector condition
Optical-aligner condition
Wafer-notch compatibility
Available laser spot sizes
Marking-depth capability
Supported marking fonts
Barcode capability
Data matrix capability
Computer configuration
Operating-system version
Control-software version
Recipe availability
SECS II/GEM availability
Factory-interface license
Data-logging capability
Process vacuum condition
Exhaust requirements
Maintenance history
Included documentation
Included accessories
Included spare parts
Current installation status
Deinstallation scope
Packing and transportation requirements
The model name alone does not confirm the complete configuration of an individual machine.
Typical Applications
The ThinkLaser SC300 can be used in semiconductor manufacturing environments requiring permanent identification of 300 mm wafers.
Semiconductor Fab Wafer Traceability
Semiconductor fabs can use permanent wafer IDs to connect physical wafers with production recipes, inspection results, equipment records and manufacturing history.
Silicon Wafer Manufacturing
Silicon wafer manufacturers can apply identification codes before wafers are supplied to downstream semiconductor fabrication facilities.
High-Volume 300 mm Wafer Production
The automated cassette ports, wafer robot and optical aligner allow the system to support repeated production marking with limited operator handling.
Wafer Lot and Batch Management
Lot numbers, serial numbers and production codes can be marked directly on each wafer to improve material tracking.
Cleanroom Wafer Identification
The shallow, low-debris marking process is suitable for controlled manufacturing environments where particle generation must be minimized.
Wafer Reclaim Operations
Compatible reclaimed silicon wafers can be permanently identified for incoming inspection, processing and outgoing batch management.
Research and Process Qualification
Semiconductor laboratories and process-development facilities can use the SC300 to identify test wafers, engineering samples and qualification lots.
Why Choose the ThinkLaser SC300?
The ThinkLaser SC300 is designed specifically for automated soft marking of 300 mm semiconductor wafers.
Its combination of low-debris marking, optical alignment, automated wafer transport, closed-loop laser control and factory communication makes it suitable for production environments requiring reliable wafer identification.
Compared with a general-purpose laser marking machine, the SC300 provides wafer-specific handling, semiconductor marking formats and cleanroom-oriented construction.
The system is particularly suitable for facilities that require permanent wafer traceability while minimizing marking particles and maintaining controlled wafer handling.
Frequently Asked Questions
What is the ThinkLaser SC300 used for?
The SC300 is used to apply permanent, low-debris identification marks to 300 mm semiconductor wafers for production tracking and traceability.
Is the SC300 a hard-marking or soft-marking system?
The SC300 is primarily a soft-marking system. It creates shallow dot-matrix marks while minimizing marking debris.
Which wafer size does the SC300 process?
The standard system is designed for 300 mm wafers. Some machines may include optional 200 mm bridge capability.
Can every SC300 process 200 mm wafers?
No. The machine must have the required bridge hardware, cassette adapters, robot configuration and software support.
Which wafer material is normally supported?
The standard application is polished, non-coated, pure silicon wafers.
What is the representative marking depth?
Representative dot depth is approximately 2.4 μm. The available process range may extend to approximately 5 μm depending on the machine configuration and recipe.
Can the SC300 create arc-shaped marks?
Yes. It supports both straight-line and arc-shaped dot-matrix marking.
Does the machine support automated wafer handling?
Yes. A representative configuration includes two 300 mm cassette ports, an optical aligner and an automated pick-and-place robot.
Does the SC300 support factory communication?
The system can include a SECS II/GEM interface for communication with compatible semiconductor factory host systems.
What should be checked before purchasing a used SC300?
Buyers should inspect the laser source, wafer robot, cassette ports, optical aligner, marking quality, software version, factory interface, utility requirements and maintenance history.
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