The Canon Anelva FC7100 is a 300 mm cluster-type physical vapor deposition system developed for high-k metal-gate and other advanced semiconductor sputtering applications. The platform is designed for controlled deposition of thin metal and reactive films.
Canon Anelva identifies the FC7100 as a production sputtering platform offering atomic-level film uniformity, precise thickness control and stable reactive sputtering. The listed used machine was reported as entering service in 2011, but its exact module combination and current condition require confirmation.
Canon Anelva FC7100 Main Specifications
| Manufacturer | Canon Anelva |
|---|---|
| Model | FC7100 |
| Equipment Type | Cluster-Type PVD Sputtering System |
| Supported Wafer Size | 300 mm / 12-inch wafers |
| Primary Process | Physical vapor deposition and reactive sputtering |
| Primary Published Application | High-k metal-gate film formation |
| Maximum Installed Modules | Up to five modules in the published platform |
| Configurable Module Types | Sputtering, etching, oxidation and heating, depending on configuration |
| System Architecture | Cluster platform |
| Listed Service Year | 2011, according to the available equipment page |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, module configuration and inspection confirmation |
Key Equipment Features
Designed for 300 mm semiconductor wafers
Cluster configuration supporting multiple process modules
Up to five installed modules in the published platform architecture
Atomic-level film uniformity and precise thickness control
Stable reactive sputtering in metal and poisoned target modes
Optional etching, oxidation and heating modules
Typical Applications
The FC7100 is primarily associated with high-k metal-gate deposition for logic devices. Canon Anelva also lists applications in peripheral circuits and CMOS image-sensor manufacturing.
The exact films and process sequence depend on the installed cathodes, target materials, chamber arrangement, reactive gas system and supporting modules. A platform capability should not be treated as confirmation that every module is present on the used system.
Used Equipment Configuration and Inspection
Before quotation, customers should confirm the mainframe serial number, number and type of process chambers, cathode configuration, target materials, RF or DC power supplies, reactive gas lines, vacuum pumps, wafer-handling robot, load ports and control software.
High-k metal-gate systems may have process-specific chamber histories. Previous materials, chamber contamination, remaining targets and available process kits should therefore be reviewed before planning a new deposition application.
Request Canon Anelva FC7100 Information
Contact our team to check the current availability of the used Canon Anelva FC7100. Please provide your target film stack, wafer size, required module sequence, target materials, destination country and installation schedule.
Contact us for current equipment photos, chamber list, cathode configuration, inspection status and quotation.
Frequently Asked Questions
What wafer size does the FC7100 process?
The published FC7100 platform is designed for 300 mm, or 12-inch, semiconductor wafers.
What is the primary application of the FC7100?
Its primary published application is high-k metal-gate sputter deposition, although the installed chamber configuration determines the actual processes available.
How many process modules can the platform support?
Canon Anelva lists support for up to five installed modules. The number present on the used machine must be confirmed.
Does every FC7100 include oxidation and etching modules?
No. Etching, oxidation and heating are configurable module types. Their presence should be verified from the chamber list and machine photographs.
