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Solid Granite Overhead Platform
The placement head is supported from above without cantilevered mechanisms, helping maintain mechanical and thermal stability during precision production.
Configurable 5-Micron Die Bonding Platform
MRSI-705 5 μm Die Bonder for Flip-Chip and Advanced Packaging
The MRSI-705 is a high-precision, configurable die bonding platform for epoxy die attach, eutectic bonding, flip-chip assembly, in-situ UV curing, wafer-level material handling and complex multi-chip packaging. Review its published specifications, configurable options and project requirements before requesting a machine.
±5 μmPlacement accuracy at 3 sigma
±1.5 μmPlacement repeatability at 3 sigma
1,000 UPHPublished reference placement rate
10-2,000 gProgrammable placement force
MRSI-705 Die BonderConfiguration and included modules must be verified before quotation.
5 μm Platform
Large Work AreaApproximately 700 square inches for configurable material inputs, tooling and product handling.
Flexible Die InputSupports configured combinations of wafer, Gel-Pak, waffle pack and tape feeder inputs.
Closed-Loop ForceProgrammable force control supports sensitive GaAs, InP, MEMS and thin-die handling.
Integrated ProcessesAvailable options include dispensing, stamping, eutectic bonding, UV curing and flip-chip assembly.
MRSI-705 Overview
What Is the MRSI-705 Die Bonder?
The MRSI-705 is a configurable high-precision die bonder designed around a solid granite overhead platform. Supporting the placement head from above avoids cantilevered mechanisms and improves thermal stability, mechanical stability and settling performance.
Its X and Y axes use actively cooled ironless linear motors with high-resolution linear encoders, while the Z axis uses air-bearing technology. This architecture supports repeatable component placement, high-speed positioning and controlled handling of fragile semiconductor devices.
The platform can be configured for development, prototype, mixed-product or production environments. Typical processes include epoxy die attach, eutectic bonding, flip-chip placement, thermo-compression, in-situ UV curing and integrated dispensing.
This page focuses exclusively on the MRSI-705 model, technical specifications and available configurations. For a broader brand and model introduction, visit our MRSI die bonder system overview.
Technical Data
MRSI-705 Die Bonder Specifications
The specifications below are based on the referenced MRSI-705 technical document. Individual machines may differ according to production year, software, tool banks, bond heads, material handlers and process options.
Published Platform Data
01
Platform, Accuracy and Motion
| Specification | Published Value | Evaluation Note |
|---|---|---|
| Platform structure | Solid granite overhead platform with no cantilevered mechanisms | Designed to improve mechanical and thermal stability. |
| Placement accuracy | ±5 μm at 3 sigma | Actual performance should be confirmed by calibration and acceptance testing. |
| Placement repeatability | ±1.5 μm at 3 sigma | Results depend on tooling, component geometry and machine condition. |
| Placement rate | Up to 1,000 UPH | Reference rate; actual output depends on process steps, vision, travel and material input. |
| Configurable work area | Approximately 700 sq. in. | Usable area changes according to installed feeders, wafer handlers, stages and fixtures. |
| X/Y drive construction | Ironless, zero-force, actively cooled linear motors | Closed-loop positioning through high-resolution linear encoders. |
| X/Y encoder resolution | 0.1 μm | Encoder resolution should not be interpreted as placement accuracy. |
| X/Y speed | 1 m/s or approximately 40 in/s | Maximum axis speed does not represent complete process cycle time. |
| Z-axis placement mode | Place to force or place to height | Applicable mode depends on recipe and installed head configuration. |
| Force control | Programmable per placement with real-time closed-loop feedback | Supports separate force values for different component types. |
| Placement force range | 10 g to 2,000 g | Confirm load cell, bond head and calibration for the required range. |
02
Axis Travel and Resolution
| Axis | Published Travel | Published Resolution |
|---|---|---|
| X axis | 20.00 in / 508 mm | 0.1 μm |
| Y axis | 25.00 in / approximately 635 mm | 0.1 μm |
| Z axis | 1.25 in / approximately 32 mm | 0.4 μm |
| Theta axis | 360° rotation | 0.004° |
03
Vision, Lighting and Software
| Specification | Published Configuration | Function |
|---|---|---|
| Vision recognition | Boundary detection and pattern recognition | Locates die centers, edges, application features and substrate fiducials. |
| Die orientation | Full 360° detection and orientation | Supports orientation-critical MMIC, laser and beam-lead components. |
| Downward cameras | Two downward-looking cameras with high and low magnification | Used for component and substrate inspection and alignment. |
| Upward camera | One upward-looking camera | Supports underside inspection and alignment where configured. |
| Lighting | Programmable red, green and blue ring or coaxial lighting | Improves contrast for difficult surfaces such as gold features on alumina. |
| Remote process view | Real-time network camera | Allows remote observation of the operating process. |
| User interface | Windows-based graphical interface | Supports setup, production programming and process operation. |
| Programming data | XML database, CAD download and offline programming support | Facilitates program management and production data integration. |
| Motion control | Up to 32 controlled motion axes | A common controller may manage machine axes and conveyors. |
| Traceability | Barcode program selection, material traceability and network connectivity | Configuration and software version must be verified on the actual machine. |
04
Dispensing and Height Measurement
| Specification | Published Configuration | Capability |
|---|---|---|
| Dual epoxy dispensing | Two-cartridge rotary positive-displacement pumps or time/pressure pumps | Supports die attach, dam-and-fill and lid-attach material dispensing. |
| Height sensor | Three-point laser height measurement | Measures surface tilt before dispensing. |
| Dispense control | Closed-loop servo motor control | Improves material-volume and bond-line control. |
| Needle management | Automatic cleaning, alignment, calibration and priming | Reduces setup effort and improves repeatability between patterns. |
| Dispensing patterns | Small dots, lines and area filling | Suitable configuration depends on pump, needle and material rheology. |
| Minimum epoxy dot | Approximately 0.004 in / 100 μm | Referenced for the appropriate dispensing or stamping configuration. |
05
Tooling and Bond Heads
| Specification | Published Configuration | Configuration Note |
|---|---|---|
| Pickup tools | Vacuum surface pickup tools | Tool geometry must match die dimensions, surface and fragility. |
| Collet types | Perimeter, two-sided and four-sided inverted-pyramid collets | Custom collet designs may also be used. |
| Standard tool bank | 13-position automatic tool-change bank | Additional tool banks may be installed to hold more tools. |
| Epoxy stamping tools | Stored in the standard 13-position tool bank | Pickup and stamping tools are automatically interchangeable. |
| Optional bond heads | Up to six placement heads | Each configured head may have independent force control. |
| Optional high-volume turret | Up to 12 tools with on-the-fly, zero-time tool change | This is a separate optional configuration, not the standard 13-position tool bank. |
06
Material Input and Product Handling
| Specification | Published Capacity | Configuration Note |
|---|---|---|
| Waffle packs and Gel-Paks | Sliding shuttle presentation | Available layout depends on the installed Sector Plate Shuttle. |
| Waffle-pack capacity | Up to 90 × 2 in × 2 in packs | Alternatively, up to 24 × 4 in × 4 in packs or a combined layout. |
| Tape feeders | 8 mm, 16 mm or 24 mm | Multiple feeder bases may be configured. |
| 8 mm feeder capacity | Up to 30 feeders | Exact capacity depends on work-area configuration. |
| Wafer input | Up to 8-inch wafer support | Uses motorized ejector hardware and theta compensation for frame or ring. |
| Wafer functions | Wafer mapping and ink-dot recognition | Helps select known-good die from the wafer. |
| Thin-die handling | Servo-synchronized pickup head and ejector movement | A needleless ejector option may be available for ultra-thin devices. |
| Minimum die size | Documented as approximately 0.006 in square | Confirm tool, vision, ejector and process suitability for very small die. |
| Maximum die size | No practical fixed limit stated | Actual limit depends on work area, mass, tooling, coplanarity and handling. |
| Minimum die thickness | Approximately 0.001 in | Thin-die capability depends on ejector, tool design and die structure. |
| Typical materials | GaAs, InP, silicon and solder preforms | Additional materials may be processed after application evaluation. |
| Product transport | Conveyor for boats, trays, carriers, fixtures, lead frames or boards | Available in standalone, cassette-to-cassette or in-line configurations. |
| Communication | SMEMA-compatible interface | Supports integration with ovens and other production equipment. |
Specification notice: MRSI-705 equipment may be configured differently according to production year, original application and later upgrades. Published platform data must be verified against the machine serial number, installed hardware, software version and acceptance test before purchase.
Standard Platform Features
How the MRSI-705 Supports Precision Assembly
The base platform combines mechanical stability, programmable force, advanced vision and flexible material presentation before application-specific options are added.
02
Closed-Loop Linear Positioning
Actively cooled ironless linear motors and 0.1 μm encoder resolution support fast motion, controlled settling and repeatable axis positioning.
03
Programmable Force Control
Placement force can be programmed by component type with real-time feedback for delicate III-V semiconductors, MEMS and thin devices.
04
Advanced Vision Alignment
Boundary detection, pattern recognition, fiducial alignment and 360-degree orientation support complex optical, RF and multi-chip assemblies.
05
Programmable RGB Lighting
Ring and coaxial red, green and blue lighting can be adjusted for low-contrast components and challenging reflective surfaces.
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Configurable Material Presentation
Wafer, Gel-Pak, waffle pack, tape feeder and conveyor inputs can be combined according to the required product and production flow.
Configurable Processes
MRSI-705 Bonding and Dispensing Options
The MRSI-705 is an open platform. These functions are not automatically included on every machine and must be verified before quotation.
Epoxy Die Attach
Supports configured epoxy stamping or dispensing before die placement. Multiple epoxy materials and die sizes can be handled on the same platform.
Standalone Eutectic Bonding
Available configurations may support AuSi, AuSn and AuGe bonding on submounts, TO headers and butterfly packages.
In-Line Eutectic Bonding
Conveyor-based material handling can combine preheating, pulse-heated bonding, programmable scrub, cover gas and controlled cooling.
Die Inversion and Placement
Configured flip-chip processes use die orientation, vision alignment and controlled placement for bumped, soldered or adhesive assemblies.
In-Situ UV Dispensing and Curing
Components can be held in position while UV adhesive is cured, reducing movement after precision placement in optical and AOC assemblies.
Dual-Cartridge Dispensing
Positive-displacement or time-pressure pumps support dots, lines, dam-and-fill material, die attach adhesive and lid attach processes.
Epoxy Stamping
A rotary stamping well and interchangeable stamping tools can create epoxy dots down to approximately 100 μm.
Thermo-Compression and Coplanarity
Application-specific configurations can support controlled pressure, height and coplanarity for large or high-aspect-ratio devices.
Production Configuration
Material Handling and Automation Choices
The machine can be configured according to the required production volume, product flow and material presentation method.
Standalone Operation
R&D / Low VolumeStandalone tooling provides greater flexibility for development, prototyping, engineering changes and small-lot production.
- Faster setup for frequently changing products
- Suitable for manual loading and flexible fixtures
- Supports process development and prototype builds
Cassette-to-Cassette
Automated LoadingMagazine or cassette-based loading reduces manual handling and supports repeated processing of carriers, trays or package fixtures.
- Reduced operator handling between cycles
- Improved consistency for batch production
- Compatible with configured input and output magazines
In-Line Conveyor
Production LineSMEMA-compatible material transport can integrate the MRSI-705 with upstream and downstream equipment.
- Handles boats, trays, lead frames and boards
- Can integrate with in-line ovens and process stations
- Reduces product transfers and handling defects
Direct Wafer Pick
Known-Good DieWafer feeding reduces manual die handling and supports automated selection from mapped or ink-marked wafers.
- Automatic theta compensation
- Wafer mapping and ink-dot detection
- Synchronized pickup head and ejector movement
Tool Change Clarification
Standard Tool Bank vs Optional High-Volume Turret
These are two different MRSI-705 configurations and should not be combined into one specification.
Standard Configuration
13-Position Tool Bank
The standard automatic tool-change bank holds pickup collets and epoxy stamping tools. Additional tool banks can be added when a process requires more component-specific tools.
Optional High-Volume Configuration
12-Tool On-the-Fly Turret
The optional patented turret carries up to 12 tools on the placement head and performs zero-time tool changes to increase output for multi-die and mixed-process products.
Application Coverage
MRSI-705 Die Bonder Applications
The platform is used where placement accuracy, configurable processes, material flexibility and controlled component handling are important.
3D and Wafer-Level Packaging
Multi-die, stacked-device and wafer-level advanced packaging applications.
Photonics and Optical Packages
Laser diodes, lenses, optical modules, transceivers and active optical cables.
Microwave and RF Modules
MMICs, RF power amplifiers, beam-lead devices and hybrid microwave assemblies.
MEMS and Sensor Devices
Pressure sensors, infrared sensors and devices containing fragile microstructures.
LED and Lighting Packages
Precision assembly of LED devices and related optoelectronic packages.
Multi-Chip Modules
Complex products containing several die types, dimensions and bonding processes.
Medical Electronics
Medical imaging, hearing devices, pacemaker components and other precision assemblies.
Aerospace and Defense
High-reliability hybrid circuits and mission-critical semiconductor packages.
Configuration Verification
Information Required Before an MRSI-705 Quotation
The MRSI-705 model name alone does not identify all installed capabilities. Provide the application information below so that the available machine can be evaluated against your process.
Required placement accuracy and repeatability
Die dimensions, thickness, material and fragility
Substrate dimensions, material and fixture format
Face-up, flip-chip or thermo-compression process
Epoxy, eutectic, UV or dispensing requirement
Required temperature, force, scrub and cover gas
Wafer, waffle pack, Gel-Pak or tape input
Expected throughput and product change frequency
Required cameras, tool banks and bond heads
Destination, inspection and installation requirements
Equipment Project Support
MRSI-705 Sourcing and Technical Coordination
Our work is focused on matching the available equipment configuration to the intended process rather than offering an unidentified machine by model name alone.
Machine Identification
Confirm the model plate, serial number, production year, software and installed hardware.
Configuration Review
Check bond heads, tool banks, vision, wafer handling, feeders, stages and process modules.
Condition Assessment
Review current photographs, power-on status, calibration information and known faults.
Delivery Coordination
Support packing, shipping, installation planning, parts preparation and technical follow-up.
MRSI Content Structure
Continue to the Correct MRSI Equipment Page
Each page serves a separate search and procurement requirement, reducing content overlap between the MRSI brand page and individual model pages.
Frequently Asked Questions
MRSI-705 Die Bonder FAQ
What is the placement accuracy of the MRSI-705?
The published MRSI-705 placement accuracy is ±5 μm at 3 sigma, with published placement repeatability of ±1.5 μm at 3 sigma. Actual machine performance should be verified through calibration and an agreed acceptance test.
What is the placement speed of the MRSI-705?
The referenced technical document lists a placement rate of up to 1,000 units per hour. Actual production output depends on vision time, travel distance, tool changes, dispensing, heating, scrub, material presentation and product complexity.
What placement force can the MRSI-705 apply?
The documented programmable placement-force range is approximately 10 g to 2,000 g, with real-time closed-loop feedback. The installed load cell and bond-head configuration must be confirmed.
Can the MRSI-705 perform flip-chip bonding?
Yes, the MRSI-705 platform is flip-chip capable. The actual machine must include the necessary vision, die inversion, tooling, force control, stage and process options for the intended flip-chip application.
Can the MRSI-705 pick dies directly from a wafer?
A configured MRSI-705 can support direct pick from wafers up to 8 inches. Available functions may include theta compensation, synchronized ejector movement, wafer mapping, ink-dot recognition and a needleless ejector option for ultra-thin devices.
Does the MRSI-705 have a 12-position or 13-position tool changer?
The standard automatic tool bank has 13 positions. A separate optional high-volume turret carries up to 12 tools on the placement head and enables on-the-fly, zero-time tool changes. They are different configurations.
What eutectic processes can the MRSI-705 support?
Configured systems may support direct or reflow eutectic bonding using material systems such as gold-silicon, gold-tin and gold-germanium. Options can include pulse heating, programmable temperature ramps, closed-loop contact force, mechanical scrub and heated hydrogen or nitrogen cover gas.
Can dispensing and die placement be completed on the same MRSI-705?
Yes, a suitably configured machine can combine dual-cartridge dispensing, epoxy stamping and die or lid placement on one platform. Dispensing hardware and software options must be confirmed on the actual system.
What information should be provided when requesting an MRSI-705?
Provide the required placement accuracy, bonding process, die and substrate dimensions, component input format, force and temperature requirements, throughput target, preferred machine condition, destination and requested technical support.
MRSI-705 Equipment Inquiry
Request Available Configuration and Technical Review
Send your process and component information so that the available MRSI-705 configuration can be checked against the required bonding, handling and production conditions.
- Required epoxy, eutectic, flip-chip or UV process
- Die and substrate dimensions and materials
- Required accuracy, force, temperature and throughput
- Wafer, waffle pack, Gel-Pak or tape feeder input
- Destination and required inspection or installation support
Request MRSI-705 Information
Please provide as much application information as possible for a more accurate equipment evaluation.
MRSI, Mycronic and related product names are trademarks of their respective owners. SemiMachine is an independent semiconductor equipment sourcing and technical support provider and is not presented as the original manufacturer.