The PVA TePla / Technics 600 Autoload is a semi-automatic RF plasma asher used for photoresist stripping, wafer surface cleaning and selected dry plasma etching processes. The system uses a 13.56 MHz RF generator and supports semiconductor wafers up to 200 mm, depending on the installed loading configuration and substrate holder.
This used system is listed with 1,731 operating hours and a Leybold TRIVAC D65-series vacuum pump. The exact loading mechanism, RF generator condition, gas configuration, pump model suffix and current operating status should be confirmed before purchase.
PVA TePla 600 Autoload Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | 600 Autoload / 600-AL |
| Equipment Type | Semi-Automatic RF Plasma Asher and Etching System |
| Maximum Wafer Size | Up to 200 mm, according to the matching equipment configuration |
| RF Frequency | 13.56 MHz |
| RF Generator | ENI RF generator |
| RF Power | 0–600 W |
| Process Chamber Material | Ceramic |
| Chamber Diameter | 245 mm |
| Chamber Depth | 380 mm |
| Process Gas Channels | Four MFC-controlled gas channels, according to the matching equipment configuration |
| Vacuum Pump | Leybold TRIVAC D65-series vacuum pump; exact model suffix to be confirmed |
| Recorded Operating Hours | 1,731 hours, according to the available equipment listing |
| Electrical Supply | 230 V, 50/60 Hz; current and power rating should be confirmed from the machine nameplate |
| Approximate System Dimensions | 740 × 624 × 701 mm, excluding external connections and vacuum equipment |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
Key Equipment Features
13.56 MHz RF-generated plasma
Adjustable RF power up to 600 W
Ceramic process chamber with a 245 mm diameter
Processing capability for wafers up to 200 mm
Four MFC-controlled process gas channels in the matching configuration
Semi-automatic substrate loading and plasma processing
Leybold TRIVAC D65-series vacuum pump
Suitable for resist stripping, cleaning and selected material etching processes
Typical Applications
The Tepla 600 Autoload is primarily used for plasma photoresist stripping and surface cleaning in semiconductor wafer processing. It can remove residual resist after lithography or etching and clean organic contamination from wafer surfaces before later fabrication steps.
Other published applications for the platform include removal of organic passivation layers and masks, polyimide removal and selected plasma treatment of silicon, silicon dioxide, silicon nitride, glass and ceramic. Actual etch rate, material selectivity and process uniformity depend on the installed electrode configuration, gas chemistry, pressure control, RF condition and qualified process recipe.
RF Plasma Process Configuration
Unlike the microwave plasma systems in the PVA TePla 660 and GIGA series, this Tepla 600 configuration uses a 13.56 MHz ENI RF generator. RF plasma can provide both chemically reactive species and ion-assisted surface interaction, depending on the process gas, pressure, power and substrate position.
The system should not automatically be treated as a high-selectivity production RIE tool. Customers planning silicon, oxide or nitride etching should first confirm the electrode arrangement, matching network, pressure control, available gases and existing process records.
Used Equipment Configuration and Inspection
The specifications above are based on the available listing and matching information for a Tepla 600-AL system with the same reported operating hours. The actual installed components should be checked against current machine photographs, identification labels and an inspection report.
Before quotation, customers should confirm the machine serial number, 1,731-hour controller record, ceramic chamber condition, RF generator, matching network, four MFC models and ranges, substrate holder, loading mechanism, pressure gauges, vacuum valves, Leybold pump model, control system, safety interlocks and current power-on status.
The electrical current rating is reported differently across available listings. The facility power requirement should therefore be taken from the machine nameplate rather than assumed from secondary equipment information.
Request PVA TePla 600 Autoload Information
Contact our team to check the current availability of the used PVA TePla / Technics 600 Autoload. Please provide your wafer size, substrate material, target stripping or etching process, required gases, destination country and expected installation schedule.
Contact us for current machine photos, serial number, installed configuration, operating-hour record, inspection status and quotation.
Frequently Asked Questions
What is the PVA TePla 600 Autoload used for?
It is mainly used for plasma photoresist stripping, organic residue removal and wafer surface cleaning. The platform may also support selected etching of silicon, silicon compounds, glass, ceramic and polyimide when correctly configured and qualified.
Is the Tepla 600 a microwave or RF plasma system?
This 600 Autoload configuration is an RF plasma system using an ENI generator operating at 13.56 MHz with output power up to 600 W.
What wafer size can the system process?
The matching equipment configuration is specified for wafers up to 200 mm. The installed substrate holder and loading mechanism should be inspected before confirming compatibility with a specific wafer size.
Does Autoload mean that the machine is fully automatic?
Not necessarily. Although the equipment is marketed as the 600 Autoload or 600-AL, matching specifications describe it as a semi-automatic RF plasma system. The installed loading sequence and required operator steps should be demonstrated during inspection.
Does the machine include a vacuum pump?
The available listing identifies a Leybold TRIVAC D65-series vacuum pump. The exact pump suffix, oil condition, pumping performance and included connection components should be confirmed on the available machine.
