The PVA TePla / Technics GIGA 690 is a low-pressure microwave plasma system developed for cleaning and surface activation in semiconductor and microelectronic packaging. It introduces 2.45 GHz microwave energy through a window in the vacuum chamber to generate a chemically reactive plasma without RF electrodes inside the chamber.
The system is commonly used before die attach, wire bonding, flip-chip underfill, encapsulation and ball attach. The available machine was listed as a 2010 system, but its current operating condition, installed process configuration and included vacuum equipment should be confirmed before purchase.
PVA TePla GIGA 690 Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | GIGA 690 |
| Equipment Type | Low-Pressure Microwave Plasma Cleaning and Activation System |
| Equipment Year | 2010, according to the available equipment listing |
| Process Chamber Material | Aluminum |
| Chamber Volume | 91 L |
| Chamber Inner Dimensions | 450 × 450 × 450 mm |
| Plasma Frequency | 2.45 GHz |
| Microwave Power | 0–1,000 W |
| Standard Gas Channels | Two channels, each with a mass flow controller and solenoid valve |
| Vacuum Connection | DN 63 ISO K |
| Base Pressure | Approximately 2 × 10-2 mbar |
| Process Pressure | Approximately 0.2–2 mbar |
| Evacuation Time | Approximately 1 minute |
| System Control | PC-based controller with 10.4-inch graphical display |
| Operating System | QNX real-time operating system |
| Electrical Supply | 230 V, single-phase, 15 A, 50/60 Hz |
| Process Gas Supply | 1/4-inch Swagelok connection, 1–2 bar input pressure |
| Compressed Air Supply | 1/4-inch Swagelok connection, 4–6 bar input pressure |
| Approximate Dimensions | 1,050 × 1,750 × 800 mm |
| Approximate Weight | 195 kg, system only and excluding the vacuum pump |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
Key Equipment Features
2.45 GHz low-pressure microwave plasma generation
Continuously adjustable microwave power up to 1,000 W
Large 91 L aluminum process chamber
Electrode-free microwave energy coupling inside the chamber
Standard two-channel MFC-controlled process gas delivery
Manual and automatic process control
Storage for multiple recipes with multi-step processing
Optical plasma intensity monitoring and safety interlocks
Typical Applications
The GIGA 690 is designed primarily for plasma cleaning and surface activation of semiconductor packages, substrates, lead frames and related components. Typical process positions include cleaning before die attach and wire bonding, activation before molding or encapsulation, preparation before flip-chip underfill and cleaning before solder ball attachment.
Microwave plasma treatment is mainly driven by chemically reactive radicals. This diffuse plasma can reach surfaces and small spaces within compatible magazines or product carriers while reducing the directional ion bombardment associated with some electrode-based plasma processes.
Used Equipment Configuration and Inspection
The specifications above describe the published GIGA 690 platform from the same general production period as the listed 2010 machine. The actual equipment may have a different chamber door, product carrier, vacuum pump, number of gas channels or optional plasma configuration.
Available options for the platform included additional gas channels, a 400 mm rotary platform, alternative pumping systems and an ECR configuration. These features should not be treated as installed unless they can be verified from the machine photographs, nameplate, component list or inspection report.
Before quotation, customers should confirm the serial number, chamber condition, microwave generator, gas configuration, MFC models, vacuum pump, rotary platform, control computer, QNX software, included product carriers, operating hours and current power-on status.
Request GIGA 690 Information
Contact our team to check the current availability of the used PVA TePla / Technics GIGA 690. Please provide your product type, packaging process, required treatment gases, carrier dimensions, destination country and expected installation schedule so that the available system can be reviewed.
Contact us for machine photos, serial number, installed configuration, inspection status and quotation.
Frequently Asked Questions
What is the PVA TePla GIGA 690 used for?
The GIGA 690 is mainly used for plasma cleaning and surface activation before semiconductor packaging processes such as die attach, wire bonding, underfill, molding, encapsulation and solder ball attachment.
Is the GIGA 690 a precision plasma etching system?
The GIGA 690 is primarily a microwave plasma cleaning and activation system. It may remove organic contamination or modify surfaces, but it is not mainly designed as a precision pattern-transfer etcher for semiconductor device structures.
What is the process chamber size?
The published system from this production period has a 91 L aluminum chamber with internal dimensions of 450 × 450 × 450 mm.
How many process gas channels does the system have?
The standard platform has two gas channels, each controlled by a mass flow controller and solenoid valve. Three or four gas channels were available as options and must be verified on the individual machine.
Is this 2010 GIGA 690 currently operational?
The available listing identifies the machine as a 2010 system, but it does not confirm its current operating condition. The microwave source, vacuum pump, gas controls, chamber, software and power-on status should be inspected before quotation.
