The PVA TePla / Technics 660 is a low-pressure microwave plasma system configured for edge isolation etching in solar cell production. The process removes the conductive doped layer around the cell edges to electrically isolate the front and rear surfaces and reduce unwanted current leakage.
This available machine was manufactured in 2008 and is listed with only 16 operating hours. Its reported configuration includes a 350 mm diameter stage, three MFC-controlled process gas inputs, a vent gas input and an EBARA oil-free dry vacuum pump. The current operating condition and completeness should still be confirmed before purchase.
PVA TePla Technics 660 Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | 660 |
| Equipment Type | Low-Pressure Microwave Plasma Etching System |
| Configured Process | Solar Cell Edge Isolation Etching |
| Equipment Year | 2008, according to the available equipment listing |
| Recorded Operating Hours | 16 hours, according to the available equipment listing |
| Plasma Frequency | 2.45 GHz |
| Microwave Power | 0–1,000 W |
| Process Chamber Material | Aluminum |
| Chamber Volume | 64 L |
| Chamber Inner Dimensions | 400 × 400 × 400 mm |
| Installed Process Gas Inputs | Three MFC-controlled gas inputs, according to the equipment listing |
| Stage | 350 mm diameter stage option, according to the equipment listing |
| Vacuum Connection | DN 63 ISO K |
| Base Pressure | Approximately 2 × 10-2 mbar |
| Process Pressure | Approximately 0.2–2 mbar |
| Evacuation Time | Approximately 1 minute |
| Included Vacuum Pump | EBARA oil-free dry pump, according to the equipment listing |
| Electrical Supply | 230 V, single-phase, 16 A, 50/60 Hz |
| Approximate Dimensions | 1,050 × 1,720 × 770 mm |
| Approximate Weight | 180 kg, excluding the vacuum pump |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
Key Equipment Features
2.45 GHz low-pressure microwave plasma generation
Adjustable microwave output up to 1,000 W
64 L aluminum process chamber without internal RF electrodes
Configured for solar cell edge isolation etching
350 mm diameter substrate stage option
Three MFC-controlled process gas inputs
EBARA oil-free dry vacuum pump included in the listed configuration
Manual and automatic processing with stored recipes
Solar Cell Edge Isolation Etching
During solar cell production, the doped layer can extend around the wafer edges and create an electrical connection between the front and rear surfaces. Plasma edge isolation removes this conductive edge region so that the P-N junction remains electrically separated.
In a typical stack-based plasma process, only the exposed cell edges are etched while adjacent wafers protect the main front and rear surfaces. The actual gas chemistry, loading arrangement, etch result and supported substrate dimensions depend on the installed stage, gas system and validated process recipe.
Additional Plasma Processing Capability
The 660 platform was also developed for low-pressure plasma cleaning and surface activation of semiconductor packages before die attach, wire bonding and encapsulation. However, this individual machine is specifically listed with an edge isolation etching configuration.
Use for package cleaning, photoresist processing or another plasma application should only be considered after confirming chamber compatibility, gas materials, seals, pumping configuration, substrate holder and process-development requirements.
Used Equipment Configuration and Inspection
The published platform specifications and the installed configuration of an individual used system are not necessarily identical. This machine is reported to include three MFC gas inputs, a vent gas connection, a 350 mm stage and an EBARA dry pump, but each component should be verified from current photographs and an inspection.
Before quotation, customers should confirm the serial number, recorded operating hours, microwave generator, chamber condition, MFC models, gas compatibility, stage movement, vacuum pump model, control system, safety interlocks, available recipes and current power-on status.
Request PVA TePla 660 Information
Contact our team to check the current availability of the used PVA TePla / Technics 660. Please provide your substrate type, wafer or cell dimensions, target edge isolation process, required gases, destination country and expected installation schedule.
Contact us for current equipment photos, serial number, operating-hour record, installed configuration, inspection status and quotation.
Frequently Asked Questions
What is the PVA TePla Technics 660 used for?
This specific machine is configured for microwave plasma edge isolation etching in solar cell production. The 660 platform can also support plasma cleaning and surface activation when equipped and validated for those processes.
What does edge isolation etching remove?
It removes the conductive doped layer around the edges of a solar cell so that the front and rear surfaces do not remain electrically connected around the wafer perimeter.
Does this machine include a vacuum pump?
The available equipment listing states that an EBARA oil-free dry pump is included. The exact pump model, operating condition and connection components should be confirmed during inspection.
How many process gas inputs are installed?
The listed machine has three MFC-controlled process gas inputs and a separate vent gas input. The MFC ranges and compatible gases need to be verified from the installed components.
Has this PVA TePla 660 been heavily used?
The equipment listing reports only 16 operating hours. This value should be checked against the machine controller, maintenance records or other available operating-hour evidence before it is treated as confirmed.
