The PVA TePla / Technics GIGAbatch 360M is a batch microwave plasma asher designed for photoresist removal, wafer cleaning and surface treatment in semiconductor processing. It uses 2.45 GHz microwave plasma in a vacuum chamber and can process multiple wafers in one batch.
Typical uses include photoresist ashing, resist removal before wet chemical cleaning, descum treatment and removal of organic residues. The available machine was listed as a 2013 system, but its operating condition, installed options and included accessories should be confirmed before purchase.
PVA TePla GIGAbatch 360M Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | GIGAbatch 360M |
| Equipment Type | Microwave Plasma Batch Asher and Wafer Cleaning System |
| Plasma Frequency | 2.45 GHz |
| Microwave Power | 0–1,000 W |
| Vacuum Chamber Material | Quartz |
| Chamber Diameter | 245 mm |
| Chamber Depth | 395 mm |
| Chamber Volume | 18 L |
| Wafer Capacity | Up to 50 wafers with a diameter of 150 mm, depending on the installed wafer carrier |
| Process Gas Control | Two MFC-controlled gas lines in the base platform configuration |
| Process Monitoring | Wafer temperature monitoring and endpoint detection in the base platform configuration |
| Electrical Connection | 230 V, 15 A, 50/60 Hz |
| Approximate Dimensions | 795 × 1,540 × 710 mm |
| Approximate Weight | 190 kg |
| Equipment Year | 2013, according to the available equipment listing |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
Key Equipment Features
2.45 GHz microwave plasma generation
Adjustable microwave power up to 1,000 W
245 mm diameter quartz process chamber
Batch processing for wafers up to 150 mm
Capacity for up to 50 wafers with the appropriate carrier
Motorized chamber door for wafer loading
MFC-controlled process gas delivery
Designed for controlled batch plasma processing
Typical Applications
The GIGAbatch 360M is primarily used for plasma ashing and stripping of photoresist from semiconductor wafers. It may be used before wet chemical cleaning to remove remaining resist and organic contamination from wafer surfaces.
Other applications may include descum treatment, dry plasma cleaning and surface activation before later coating, bonding or fabrication steps. Actual process compatibility depends on the installed gas lines, wafer carrier, chamber materials, seals and available process recipes.
Used Equipment Configuration and Inspection
The specifications above describe the published GIGAbatch 360M platform. The actual configuration of this used machine may vary because gas lines, wafer carriers, process monitoring devices, vacuum pumps and optional accessories can differ between individual systems.
Before quotation, customers should confirm the serial number, chamber condition, microwave generator, vacuum system, MFC configuration, endpoint detector, temperature monitoring, control system, wafer carrier, available documentation and current power-on status.
Optional platform configurations can include active process pressure control, a Faraday cage, additional gas lines, alternative substrate loading devices, a ceramic process chamber and special seals for fluorine-containing process gases. These options should not be assumed unless they are verified on the available machine.
Request GIGAbatch 360M Information
Contact our team to check the current availability of the used PVA TePla / Technics GIGAbatch 360M. Please provide your wafer size, target process, required process gases, expected batch capacity, destination country and installation schedule so that we can review the available configuration.
Contact us for equipment photos, serial number, installed configuration, inspection status and quotation.
Frequently Asked Questions
Is the GIGAbatch 360M a plasma etcher or a plasma asher?
The GIGAbatch 360M is primarily a microwave plasma asher and wafer cleaning system. It is commonly used for photoresist removal, descum treatment and surface cleaning rather than precision pattern-transfer etching.
What wafer size can the GIGAbatch 360M process?
The published 360M platform can process wafers up to 150 mm in diameter. It can hold up to 50 wafers when fitted with the appropriate wafer carrier.
What is the main application of the GIGAbatch 360M?
Its main application is batch plasma removal of photoresist from semiconductor wafers. It may also be used for removing organic residues, plasma cleaning and surface activation.
Can the system use fluorine-containing process gases?
Fluorine-containing processes require compatible chamber materials and special seals. This capability must be confirmed from the installed configuration of the individual machine.
Is this 2013 GIGAbatch 360M currently operational?
The source listing identifies the equipment as a 2013 system, but the year alone does not confirm its current operating condition. Power-on status, completeness, chamber condition and available inspection records should be verified before quotation.
